Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
2024年7月8日 - 9:07PM
Resonac Corporation today unveiled a new consortium of ten
partners, called “US-JOINT,” for its semiconductor back-end process
R&D in Silicon Valley. The ten American and Japanese
semiconductor materials and equipment companies are: Azimuth; KLA;
Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS;
TOK; TOWA; and Resonac.
US-JOINT expands the activities of Japan-based open
consortiums led by Resonac (known as "JOINT" and "JOINT2") in the
U.S. and includes the participation of five U.S.-based companies.
US-JOINT R&D will take place at a new R&D center in Union
City, Calif., set up through co-investment with the partners. The
construction of cleanrooms and equipment installation will begin
this year, and the facility is expected to be fully operational in
2025.
Mr. Rahm Emanuel, the U.S. Ambassador to Japan,
said, “With nearly every area of our daily lives now dependent on
semiconductors, it is critical that we strengthen supply chains
through cooperation with trusted partners in the sector. This new
consortium of leading American and Japanese companies in the
semiconductor industry is the latest example of our two nations
joining forces to accelerate the development of advanced
technologies of global importance.”
US-JOINT is an open consortium designed for
end-customer collaboration to verify the latest requirements for
semiconductor packaging of advanced devices and validate new
concepts in development. In addition, by co-creating with
customers, Resonac and the US-JOINT members will capture market
needs in real time, accelerating the R&D of materials and
equipment technologies.
“Today’s rapidly expanding next-generation
semiconductors for generative AI and autonomous driving require new
approaches to advanced packaging technologies, such as 2.5D and
3D1,” said Hidenori Abe, executive director of Electronics Business
Headquarters, Resonac. “In recent years, major semiconductor
manufacturers and fabless companies in Silicon Valley, including
GAFAM2, are designing semiconductors in-house and creating new
concepts in back-end packaging one after another. This is where the
US-JOINT consortium can contribute significantly with our leading
technology in materials and equipment on-shore in the U.S.”
Advanced packaging and back-end processing of
semiconductors has traditionally been located primarily in Asia.
Bringing packaging R&D closer to major semiconductor device
makers in Silicon Valley will help to further advance the
technology and solve technical issues, especially in the areas that
other U.S. consortiums do not cover enough, including advancements
in the substrate, interposer and fabrication of the package.
Jan Vardaman, president, TechSearch
International, Inc., said, "This represents a tremendous
opportunity for U.S. companies to take advantage of the expertise
gathered in material and equipment for advanced packaging
development."
For details, please refer to the website, Resonac
Holdings Corporation: https://www.resonac.com/.
12.5D packaging is a technology to place
semiconductor chips in parallel on the interposer. 3D packaging is
a technology to laminate chips with TSV (through silicon
via).2GAFAM stands for Google, Apple, Facebook, Amazon,
Microsoft.
About the Resonac GroupThe Resonac Group was
established in January 2023 as a result of the integration of the
Showa Denko Group and the Showa Denko Materials Group (former
Hitachi Chemical Group). The Group’s annual sales of semiconductor
and electronic materials amount to approximately 340 billion yen.
The Group is recognized for its extensive lineup of semiconductor
materials for back-end processes, which have top market share
globally. The integration of the two companies has enabled the
Resonac Group to make material design and development in-house from
raw materials through to finished goods. The new trade name
“RESONAC” was created as a combination of two English words,
namely, the word “RESONATE” and “C” from the first letter of
CHEMISTRY. The Resonac Group actively leverages its co-creative
platform to accelerate technological innovation with semiconductor
manufacturers, materials manufacturers, and equipment manufacturers
in Japan and across the globe.
For additional information, contact: Media
Relations Group, Brand Communication Department (Phone:
81-3-6263-8002)Resonac Holdings Corporation
US AgencyKiterocketSandy Fewkes, Senior PR
Manager408-529-9685SFewkes@Kiterocket.com