CXCQ Cardxx Inc (PK)

Leading electronics packaging solution provider Cardxx (Pink Sheets: CXCQ) has recently appointed Kevin Kucera to the position of Chief Executive Officer and President. Instrumental to Cardxx's expansion, Kucera will oversee marketing and operations to increase market share and sales revenues. Kucera brings more than 22 years of management, operations, and marketing experience. Prior to joining Cardxx, he served as president, vice president and director for several major corporations including Infineon Technologies, Siemens, Ball Aerospace, and Cencorp. "Kevin is an asset to the company and he has a significant history in our industry. We are pleased to have him on board," said Phil A. Worack, Chairman of the Board, Cardxx. "With his extensive experience in management and negotiations, we're confident that he will contribute greatly to the overall growth of the company." Kucera's long list of career successes include his work with Infineon where he managed the exclusive design win for the launch of the American Express Blue Card, the largest cryptocontroller IC project in NAFTA history. He also negotiated the Infineon biometric sensor strategic marketing alliance with Identix, which was recognized by FutureBanker as number 10 of the Top 25 Technology Deals of 1999. As General Manager of Siemens SMT in Singapore, Kucera was instrumental in growing the business from a $200,000 a year business to one that now generates more than $100 million a year. Kucera is a graduate of the University of Colorado at Boulder and holds an MBA from Thunderbird, The Garvin School of International Management. The unique encapsulation technology pioneered by CardXX for Electronics Packaging Solutions has been selected as a finalist for the Polyurethane Innovation Award by a panel of judges for the Alliance of Polyurethane Industries (API). Three finalists were selected by an award panel of experts for demonstrating the most innovative uses of polyurethane in an end-use product. About CardXX Colorado-based CardXX has developed patented technologies to securely encapsulate electronics into smart cards and other portable devices or form factors. CardXX partnered with Spyrus to engineer the first smart card to receive certification from the National Institute of Standards and Technology (NSIT) for Overall Level 3 compliance, including Physical Security with the Federal Information Processing Standard (FIPS) 140 -- Security Requirements for Cryptographic Modules. The CardXX process offers the following unique advantages: -- Injected thermoset polymer encapsulates and protects all electronic elements completely and securely. -- Low-temperature and low-pressure process prevents damage to delicate electronics and improves manufacturing yield. -- Superior heat resistance and chemical resistance protects against physical and chemical attacks. -- Physical access to chip electronics is difficult to obtain without severe damage or destruction of chip. The forward-looking statements contained herein are subject to certain risks and uncertainties that could cause actual results to differ materially from those reflected in the forward-looking statements. Readers are cautioned not to place undue reliance on these forward-looking statements, which reflect management's analysis only as of the date hereof. The company undertakes no obligation to publicly revise these forward-looking statements to reflect events or circumstances that arise after the date thereof. Readers should carefully review the risks described in other documents the company files from time to time with the Securities and Exchange Commission, including Quarterly Reports and Current Reports on Form 8-K.