ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets
2024年7月30日 - 5:05AM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, today announced the Ultra
C vac-p flux cleaning tool for fan-out panel-level packaging
(FOPLP). Utilizing vacuum technology, the new tool efficiently
removes flux residues from chiplet structures. ACM also announced
today it received a purchase order from a major China semiconductor
manufacturer which has been shipped to the customer’s facility in
July.
“The demand for greater computing power, lower latency and
higher bandwidth driven by AI, data centers and autonomous vehicles
makes FOPLP an increasingly essential technology.” said Dr. David
Wang, ACM’s President and Chief Executive Officer. “FOPLP
integrates multiple chips, passive components and interconnections
within a single panel-packaged unit, enhancing flexibility,
scalability and cost-efficiency. ACM’s Ultra C vac-p represents a
major advancement in addressing the cleaning challenges associated
with next-generation advanced packaging technologies. This launch
not only underscores ACM’s ongoing innovation in semiconductor
manufacturing, but also our commitment to address the evolving
needs of the industry."
According to Yole Group1, FOPLP adoption will
grow faster than the overall fan-out market, and its market share
will move from 2% in 2022 to 8% in 2028. The growth of FOPLP is
primarily driven by its potential cost savings. For instance,
panels typically utilize more than 95% of the material due to their
rectangular or square shape, whereas traditional silicon wafers use
less than 85% of the material due to their circular shape. The
effective area of a 600x600mm panel is also 5.7 times larger than
that of a traditional 300mm silicon wafer, enabling overall cost
reductions of approximately 66%. This enhanced area utilization
leads to higher throughput, greater AI chip design flexibility, and
significant cost savings.
The Ultra C vac-p tool addresses critical steps in the advanced
packaging process, particularly the removal of flux residue before
underfilling, which is essential for eliminating voids. Traditional
cleaning methods often fail with small bump pitches (less than 40
microns) and large chip sizes due to surface tension and limited
liquid penetration. The vacuum technology in ACM’s new tool ensures
the cleaning liquid thoroughly reaches all gaps, even in large
panel substrates where traditional methods fall short. Combined
with ACM’s proprietary IPA drying technology, this comprehensive
cleaning process prevents residues that could impair device
performance.
About the Ultra C vac-p Cleaning Tool
The Ultra C vac-p Cleaning tool is designed for panel substrates
and accommodates both organic and glass materials. It is capable of
handling panels sized 510 mm x 515 mm and 600 mm x 600 mm, while
effectively managing cover warpages up to 7mm.
Forward-Looking Statements
Certain statements contained in this press release are not
historical facts and may be forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995.
Words such as “plans,” “expects,” “believes,” “anticipates,”
“designed,” and similar words are intended to identify
forward-looking statements. Forward-looking statements are based on
ACM management’s current expectations and beliefs, and involve a
number of risks and uncertainties that are difficult to predict and
that could cause actual results to differ materially from those
stated or implied by the forward-looking statements. A description
of certain of these risks, uncertainties and other matters can be
found in filings ACM makes with the U.S. Securities and Exchange
Commission, all of which are available at www.sec.gov. Because
forward-looking statements involve risks and uncertainties, actual
results and events may differ materially from results and events
currently expected by ACM. ACM undertakes no obligation to publicly
update these forward-looking statements to reflect events or
circumstances that occur after the date hereof or to reflect any
change in its expectations with regard to these forward-looking
statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process
equipment for single-wafer or batch wet cleaning, electroplating,
stress-free polishing, vertical furnace processes, Track and PECVD,
which are critical to advanced semiconductor device manufacturing
and wafer-level packaging. ACM is committed to delivering
customized, high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield. For more information,
visit http://www.acmr.com/.
© ACM Research, Inc. ULTRA C and the ACM Research logo are
trademarks of ACM Research, Inc. For convenience, these trademarks
appear in this press release without ™ symbols, but that practice
does not mean ACM will not assert, to the fullest extent under
applicable law, its rights to such trademarks. All other trademarks
are the property of their respective owners.
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Media
Contact: |
Company
Contacts: |
Shannon Blood |
USA |
Kiterocket |
Robert Metter |
+1 208.216.9180 |
+1 503.367.9753 |
sblood@kiterocket.com |
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China |
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Xi Wang |
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ACM Research (Shanghai),
Inc. |
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+86 21 50808868 |
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Korea |
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YY Kim |
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ACM Research (Korea),
Inc. |
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+82 1041415171 |
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Taiwan |
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David Chang |
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+886 921999884 |
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Singapore |
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Adrian Ong |
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+65 8813-1107 |
1 Gabriela Pereira, semiconductor packaging analyst for Yole
Group cited in “Fan-out Packaging Level Hurdles,” Semiconductor
Engineering, January 24, 2024.
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