TAIPEI,
Taiwan, Oct. 22, 2024 /PRNewswire/ --
DuPont (NYSE:DD) today announced it will showcase its
extensive range of advanced circuit materials and solutions at the
Taiwan Printed Circuit Association (TPCA) Show, held at the Taipei
Nangang Exhibition Center from October
23-25, 2024. DuPont will be located at Booth #K409,
presenting holistic solutions for fine line applications, advanced
packaging, signal integrity, and thermal management.
DuPont is proud to collaborate with industry leaders for the
session titled "Shaping Our Future with AI by Next-Gen Substrate
and Packaging" at the IMPACT Conference. This session will focus on
advanced packaging and integrated circuit material solutions for
artificial intelligence. Discussions will encompass topics such as
characteristics of organic substrates, the evolution of advanced
packaging materials, and the challenges and opportunities facing
integrated circuit substrates in the age of artificial
intelligence. Insights will be shared by speakers from Taiwan
Semiconductor Manufacturing Company, Samsung Electronics, Leading
Interconnect Semiconductor Technology, and DuPont Interconnect
Solutions business.
"Our new technology solutions highlight DuPont's commitment to
innovation and collaboration with industry leaders in technologies
that enable AI. As a powerhouse in advanced interconnect and
thermal management solutions, we are dedicated to enhancing data
computation and enabling data transfer speed and reliability, both
of which are critical for AI functionalities. DuPont's session at
the IMPACT Conference will showcase our innovations in advanced
packaging, such as bump plating technology for HBM and 2.5D/3D
packaging and seed layer formation on glass substrates, further
pushing the boundaries of AI technology," said Yuan Yuan Zhou,
Global Business Director, Advanced Circuit & Packaging,
DuPont.
The next-generation bump plating technologies, particularly
DuPont™ Solderon™ BP TS7100SA solder, are designed to meet the
growing demand for smaller micro-bumps for HBM and 2.5D/3D
packaging and increased I/O density while ensuring coplanarity,
consistency, and reliability in fine-pitch and mixed-pitch
packages. Its exceptional control over silver composition and
void-free integration facilitates efficient lead-free soldering in
high-performance electronic devices.
Additionally, DuPont will unveil a novel seed layer method for
glass substrates in advanced packaging that overcomes the
limitations in via coverage and adhesion present in conventional
techniques. By utilizing a polymer-based adhesion promoter, this
innovative electroless copper process achieves complete via
coverage and strong copper adhesion under low-temperature,
production-friendly conditions. This advancement significantly
enhances the viability of glass substrates for high-performance
electronics in advanced packaging applications.
DuPont's participation in the TPCA Show highlights three pivotal
themes: fine line technology, advanced packaging, and signal
integrity & thermal management. Fine line patterns accelerate
the integration of intricate circuits into compact spaces,
enhancing overall efficiency and performance. Advanced packaging
technologies optimize space utilization and support high-density
interconnections, which are crucial for AI applications that
require rapid data processing. Furthermore, maintaining signal
integrity and implementing effective thermal management are
essential for ensuring reliable functionality in high-performance
computing environments.
At the show, DuPont experts will be present at the company's
booth to share their extensive knowledge and insights on
technological advancements and industry trends. Attendees will have
the opportunity to explore DuPont's comprehensive solutions for AI
applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with
technology-based materials and solutions that help transform
industries and everyday life. Our employees apply diverse science
and expertise to help customers advance their best ideas and
deliver essential innovations in key markets including electronics,
transportation, construction, water, healthcare and worker safety.
More information about the company, its businesses and solutions
can be found at www.dupont.com. Investors can access
information included on the Investor Relations section of the
website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service
marks denoted with ™, SM or ® are owned
by affiliates of DuPont de Nemours, Inc. unless otherwise
noted.
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SOURCE DuPont