TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon
Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors
N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in
European Semiconductor Manufacturing Company (ESMC) GmbH, in
Dresden, Germany to provide advanced semiconductor manufacturing
services. ESMC marks a significant step towards construction of a
300mm fab to support the future capacity needs of the fast-growing
automotive and industrial sectors, with the final investment
decision pending confirmation of the level of public funding for
this project. The project is planned under the framework of the
European Chips Act.
The planned fab is expected to have a monthly production
capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer
planar CMOS and 16/12 nanometer FinFET process technology, further
strengthening Europe’s semiconductor manufacturing ecosystem with
advanced FinFET transistor technology and creating about 2,000
direct high-tech professional jobs. ESMC aims to begin construction
of the fab in the second half of 2024 with production targeted to
begin by the end of 2027.
The planned joint venture will be 70% owned by TSMC, with Bosch,
Infineon, and NXP each holding 10% equity stake, subject to
regulatory approvals and other conditions. Total investments are
expected to exceed 10 billion euros consisting of equity injection,
debt borrowing, and strong support from the European Union and
German government. The fab will be operated by TSMC.
“This investment in Dresden demonstrates TSMC’s commitment to
serving our customers’ strategic capacity and technology needs, and
we are excited at this opportunity to deepen our long-standing
partnership with Bosch, Infineon, and NXP,” said Dr. CC Wei, Chief
Executive Officer of TSMC. “Europe is a highly promising place for
semiconductor innovation, particularly in the automotive and
industrial fields, and we look forward to bringing those
innovations to life on our advanced silicon technology with the
talent in Europe.”
Dr. Stefan Hartung, Chairman of the Bosch board of management:
“Semiconductors are not only a crucial success factor for Bosch.
Their reliable availability is also of great importance for the
success of the global automotive industry. Apart from continuously
expanding our own manufacturing facilities, we further secure our
supply chains as an automotive supplier through close cooperation
with our partners. With TSMC, we are pleased to gain a global
innovation leader to strengthen the semiconductor ecosystem in the
direct vicinity of our semiconductor plant in Dresden.”
“Our joint investment is an important milestone to bolster the
European semiconductor ecosystem. With this, Dresden is
strengthening its position as one of the world’s most important
semiconductor hubs that is already home to Infineon’s largest
frontend site,” said Jochen Hanebeck, CEO of Infineon Technologies.
“Infineon will use the new capacity to serve the growing demand
particularly of its European customers, especially in automotive
and IoT. The advanced capabilities will provide a basis for
developing innovative technologies, products and solutions to
address the global challenges of decarbonization and
digitalisation.”
“NXP is very committed to strengthening innovation and supply
chain resilience in Europe,” said Kurt Sievers, President and CEO
of NXP Semiconductors. “We thank the European Union, Germany, and
the Free State of Saxony for their recognition of the semiconductor
industry’s critical role and for their true commitment to boost
Europe’s chip ecosystem. The construction of this new and
significant semiconductor foundry will add much needed innovation
and capacity for the range of silicon required to supply the
sharply increasing digitalization and electrification of the
automotive and industrial sectors.”
About Bosch
The Bosch Group is a leading global supplier of technology and
services. It employs roughly 421,000 associates worldwide (as of
December 31, 2022). The company generated sales of 88.2 billion
euros in 2022. Its operations are divided into four business
sectors: Mobility, Industrial Technology, Consumer Goods, and
Energy and Building Technology. As a leading IoT provider, Bosch
offers innovative solutions for smart homes, Industry 4.0, and
connected mobility. Bosch is pursuing a vision of mobility that is
sustainable, safe, and exciting. It uses its expertise in sensor
technology, software, and services, as well as its own IoT cloud,
to offer its customers connected, cross-domain solutions from a
single source. The Bosch Group’s strategic objective is to
facilitate connected living with products and solutions that either
contain artificial intelligence (AI) or have been developed or
manufactured with its help. Bosch improves quality of life
worldwide with products and services that are innovative and spark
enthusiasm. In short, Bosch creates technology that is “Invented
for life.” The Bosch Group comprises Robert Bosch GmbH and its
roughly 470 subsidiary and regional companies in over 60 countries.
Including sales and service partners, Bosch’s global manufacturing,
engineering, and sales network covers nearly every country in the
world. With its more than 400 locations worldwide, the Bosch Group
has been carbon neutral since the first quarter of 2020. The basis
for the company’s future growth is its innovative strength. At 136
locations across the globe, Bosch employs some 85,500 associates in
research and development, of which nearly 44,000 are software
engineers. Additional information is available online at
www.bosch.com, www.iot.bosch.com, www.bosch-press.com,
www.twitter.com/BoschPresse.
About Infineon
Infineon Technologies AG is a global semiconductor leader in
power systems and IoT. Infineon drives decarbonization and
digitalization with its products and solutions. The company has
around 56,200 employees worldwide and generated revenue of about
€14.2 billion in the 2022 fiscal year (ending 30 September).
Infineon is listed on the Frankfurt Stock Exchange (ticker symbol:
IFX) and in the USA on the over-the-counter market OTCQX
International over-the-counter market (ticker symbol: IFNNY).
Further information is available at www.infineon.com
Follow us: Twitter – Facebook – LinkedIn
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) brings together bright
minds to create breakthrough technologies that make the connected
world better, safer and more secure. As a world leader in secure
connectivity solutions for embedded applications, NXP is pushing
boundaries in the automotive, industrial & IoT, mobile, and
communication infrastructure markets while delivering solutions
that advance a more sustainable future. Built on more than 60 years
of combined experience and expertise, the company has approximately
34,500 team members in more than 30 countries and posted revenue of
$13.21 billion in 2022. Find out more at www.nxp.com.
About TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987, and has been the world’s leading dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s
leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North
America, TSMC serves as a committed corporate citizen around the
world.
TSMC deployed 288 distinct process technologies, and
manufactured 12,698 products for 532 customers in 2022 by providing
broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu,
Taiwan. For more information please visit https://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20230807579958/en/
Robert Bosch GmbH Athanassios Kaliudis Spokesperson
connected mobility, software and automotive electronics Tel: +49
152 08651292 E-Mail: athanassios.kaliudis@de.bosch.com
Infineon Technologies AG Andre Tauber Head of Corporate
Media Relations Tel: +49 89 234-36705 E-Mail:
Andre.Tauber@infineon.com
NXP Semiconductors Mike Silverman Sr. Director of Global
Public Relations Mobile: +1 979-350-9210 E-Mail:
Mike.Silverman@nxp.com
Taiwan Semiconductor Manufacturing Company, Ltd. Nina Kao
Head of Public Relations Tel: +886-3-563-6688 ext. 7125036 Mobil:
+886-988-239-163 E-Mail: nina_kao@tsmc.com
Ulric Kelly Public Relations Tel: +886-3-563-6688 ext. 7126541
Mobil: +886-978-111-503 E-Mail: ukelly@tsmc.com
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