TEMPE,
Ariz., July 10, 2024 /PRNewswire/ -- AEM, a
global leader in test and handling solutions, announced today the
launch of a new burn-in capability for its high-parallel test
platform, AMPS. The new variant, named AMPS-BI, is a
high-power, high-throughput, fully automated burn-in system
featuring patented advanced multi-zone Intelligent Thermal Control.
AMPS-BI is designed to efficiently perform accelerated high
voltage stress testing on advanced semiconductor devices such as AI
processors and high-performance computing units.
High voltage stress testing is critical to ensure the
reliability of AI chips and other semiconductor devices. It
exposes devices under test to extended periods of operation under
stressful conditions to detect potential failures or defects before
reaching the end consumer. As AI processors and
high-performance compute devices are manufactured with leading-edge
process technology nodes and advanced heterogeneous packages with
chiplets, the overall cost of test to provide the highest quality
of the final package is increasing significantly. AMPS-BI
leverages AEM's decades of experience in automation, thermal
management, and application-specific test instruments to offer
customers a scalable solution that reduces test times while
increasing overall test coverage, delivering a cost-of-test
advantage for its users.
AEM's AMPS-BI delivers:
- Fully automated modular system - Capable of simultaneous high
voltage stress testing of hundreds of devices in parallel
- Patented Multi-zone Intelligent Thermal Control (ITC). Scalable
to >2KW per device, with precision control for thermal stability
during test
- Application-specific test instruments - Optimized for customer
requirements to ensure optimal yield
- Individual device test control and instrumentation allow for
asynchronous operation, pattern changing on the fly, and high
system utilization
- Support for device-specific change kits and consumables,
including burn-in boards and sockets
- Support for advanced package formats, scalable beyond 100mm x
100mm package sizes
- Upgradable for System Level Test, tri-temperature, and higher
throughput
- Fully supports JEDEC-based I/O with full Factory 4.0 automation
support
"As pioneers in the industry in providing cost-effective, highly
parallel, modular automated test and handling solutions and with
over a thousand systems installed worldwide for Burn-In and System
Level Test, we are committed to delivering innovation and
excellence to semiconductor testing," said Amy Leong, Chief Executive Officer of AEM.
"I am incredibly proud of our team for developing this new
generation of Burn-In (BI) systems, which will significantly help
AI chip designers, foundries, and OSAT customers accelerate their
roadmaps."
Earlier this year, AEM announced that its burn-in test system
has been selected as the Plan-of-Record solution by a major fabless
provider of high-performance compute (HPC) and artificial
intelligence (AI) semiconductor chips.
AEM's Test 2.0 paradigm is at the forefront of test solutions
for next-generation advanced logic devices, including
high-performance compute and AI. AEM leads the industry in Active
Thermal Control, Advanced Factory Automation, and Test
Instrumentation.
For more information: www.aem.com.sg
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SOURCE AEM