BEVERLY,
Mass., Dec. 3, 2024 /PRNewswire/ -- Axcelis
Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling
ion implantation solutions for the semiconductor industry,
announced today that it will showcase its Purion™ and GSD Ovation™
Series of ion implanters at the SEMICON Japan 2024 exhibition. The
conference and exhibition are being held December 11-13, at the Tokyo Big Sight in
Tokyo, Japan. Axcelis will be in
Hall 4, Booth #4621.
Semiconductor manufacturers are invited to visit the Axcelis
exhibit to learn first-hand about innovative ion implant solutions
that deliver significant technology and manufacturing
advantages.
- Purion Power Series™ - Featuring Axcelis' innovative
solution for thin silicon, TAIKO and silicon carbide (SiC) wafer
processing across the full power device applications space, and
wafer handling capable for 150mm, 200mm and 300mm wafers.
- Purion H™ Series - Offering unmatched purity and
precision while achieving industry leading productivity across the
full high current operating space.
- Purion H200™ - Axcelis' state of the art single
wafer high current medium energy implanter designed to address the
unique implant needs for devices designed for the Internet of
Things (IoT) and power applications.
- Purion XE™ Series - The industry leading high
energy implant platform with the widest energy range, including the
Purion XEmax model featuring patented Boost Technology™ for the
most advanced image sensor applications up to 15MeV.
- Purion M™ Series - The lowest power consumption medium
current implanter offering the broadest range of mid-current doses
available, and unparalleled flexibility to meet today's evolving
implant requirements.
- GSD Ovation™ - Providing the most
cost-effective way to extend high current and high energy batch
platform capability by supporting emerging applications in wafer
splitting (Si and SiC) and alternate substrates (lithium tantalate
and ceramic).
During the show, Axcelis will also host the following events
on Thursday, Dec. 12th:
- SiC Power Device Manufacturing Ion Implant
Technology
Exhibitor's TechSPOT Hall 5, 15:30 - 15:50
p.m.
The power device market is at a critical inflection point as
chipmakers transition from 150mm to 200mm SiC wafers. Ion implant
equipment needs to offer the flexibility to handle multiple wafer
sizes, various substrate types and operate at various implant
temperatures. Please join us to learn about Axcelis' Silicon &
Silicon Carbide (SiC) power semiconductor product line, SiC implant
Al ion sources and productivity options and Si IGBT wafer handling
and proton (H+) implant solutions.
- Axcelis Happy Hour Celebration
Hall 4 Booth #4261,
16:00 – 17:00 p.m.
Join us for beverages and appetizers and meet the Axcelis
team!
President and CEO of Axcelis Technologies Russell Low, said,
"We're excited to be a part of this important market and the
opportunity to provide the most advanced ion implant technology to
Japan chipmakers. We are proud of
our growing installed base and support infrastructure in
Japan and remain focused on
expanding our market share by providing customers the most
innovative, enabling implant technology and support solutions to
ensure their success."
Charles Pieczulewski, Axcelis
Country Manager, Japan, commented,
"Japan customers continue to be
impressed by Axcelis' broad implant product portfolio for power,
image sensor, memory and logic applications. We look forward to
displaying our newest technological advancements at SEMICON
Japan."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered
in Beverly, Mass., has been
providing innovative, high-productivity solutions for the
semiconductor industry for over 45 years. Axcelis is dedicated to
developing enabling process applications through the design,
manufacture and complete life cycle support of ion implantation
systems, one of the most critical and enabling steps in the IC
manufacturing process. Learn more about Axcelis at
www.axcelis.com.
AXCELIS CONTACTS:
Japan:
Charles Pieczulewski (Country
Manager, Japan)
+81.3.5860.2586
Global:
Maureen Hart (Editorial/Media)
+1.978.787.4266
David Ryzhik (Investor Relations)
+1.978.787.2352
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SOURCE Axcelis Technologies, Inc.