US Market News
3週前
UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone DisplaysMay 14, 2026 2:00 AM
Business Wire United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the release of its 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, with the process design kit now available for customer designs. Successfully validated at UMC’s Fab 12A, the new process boosts power efficiency and performance while reducing chip size, supporting the evolution of next-generation display technologies. Compared to UMC’s 22nm process - currently the most advanced display driver IC solution in production - the 14nm eHV FinFET platform achieves up to 40% reduction in power consumption and 35% reduction in chip area, enabling longer battery life and thinner driver modules for premium smartphone models. With FinFET devices replacing planar transistors in the digital circuitry, the 14nm platform further enhances electrical performance through optimized I/O devices and higher drive speeds, ensuring robust signal integrity while supporting higher refresh rates for high-resolution display applications. In addition, the optimized mid-voltage device capabilities, featuring tighter layout pitch and a broader voltage range, provide greater flexibility for optimizing source driver circuit design. “Displays are pervasive and requirements will continue to evolve to deliver better visual quality at faster speeds and lower power consumption. UMC is proud to be a leader in the display driver IC market, and this new 14nm eHV platform marks a major step forward as we bring FinFET technology to display drivers for the first time,” said Steven Hsu, Vice President of Technology Development at UMC. “As our customers’ products continue to advance forward with new capabilities and features, UMC is committed to providing them with the foundry technologies to turn their innovations into manufacturable reality.” UMC has been the undisputed foundry leader in the OLED display driver IC market, and is currently the only foundry offering the most advanced 22nm display driver IC solution. With leading eHV technology, comprehensive IP resources, and strong design support, UMC offers the industry’s most comprehensive high-voltage process solutions, spanning from 0.6µm to 14nm nodes. About UMC UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com. Note from UMC Concerning Forward-Looking Statements Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law. View source version on businesswire.com: https://www.businesswire.com/news/home/20260513565158/en/ Media contact
UMC Corporate Communications
Michelle Yun
886-2-2658-9168 x16951
michelle_yun@umc.com Original: UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays
US Market News
1月前
UMC Reports First Quarter 2026 ResultsApril 29, 2026 7:52 AM
Business Wire
Business traction on 22nm continues to gain momentum, accounting for 14% of Q1 revenue
Expect Q2 wafer shipments to grow by high single digit
First Quarter 2026 Overview1:
Revenue: NT$61.04 billion (US$1.93 billion)
Gross margin: 29.2%; Operating margin: 18.5%
Revenue from 22/28nm: 34%
Capacity utilization rate: 79%
Net income attributable to shareholders of the parent: NT$16.17 billion (US$511 million)
Earnings per share: NT$1.29; earnings per ADS: US$0.204
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the first quarter of 2026.
First quarter consolidated revenue was NT$61.04 billion, decreasing 1.2% from NT$61.81 billion in 4Q25. Compared to a year ago, 1Q26 revenue increased 5.5%. Consolidated gross margin for 1Q26 was 29.2%. Net income attributable to the shareholders of the parent was NT$16.17 billion, with earnings per ordinary share of NT$1.29.
Jason Wang, CEO of UMC, said, “In the first quarter, our wafer shipments increased 2.7% quarter-on-quarter on strong growth in the consumer segment, lifting overall utilization rate to 79%. Despite a decline in blended average selling price during the quarter, which partly reflected higher 8-inch wafer shipments, gross margin held firm at 29.2%. Demand for our 22nm logic and specialty processes continues to gain momentum, with 22nm revenue reaching another record high and accounting for 14% of first-quarter revenue. By the end of this year, over 50 customers will have completed tape-outs on our 22nm platforms for a diverse range of applications, including display driver ICs, networking chips, and microcontrollers. We continue to invest in next-generation technologies – beyond 22nm, our 12nm collaboration with Intel will provide customers with technology continuity as well as a U.S.-based manufacturing option. UMC also recently announced important developments in emerging businesses, including a strategic partnership to deploy thin-film lithium niobate (TFLN) photonics for AI infrastructure.”
CEO Wang added, “Going into the second quarter, we expect strong wafer shipment growth across both 8-inch and 12-inch portfolios, supported by a strong rebound in the communication segment as well as healthy demand across computer, consumer, and industrial markets. While the current memory supply shortage and the ongoing conflict in the Middle East are creating certain headwinds and market volatility, UMC continues to foresee resilient market demand. UMC will continue to monitor industry and macroeconomic developments closely while prudently managing our business to cope with market dynamics amid evolving semiconductor landscape changes.”
CEO Wang said, “UMC’s long-term commitment to corporate sustainability was once again recognized in S&P Global’s annual Sustainability Yearbook. With only 848 out of 9,200 large corporations selected for the 2026 Yearbook, UMC was awarded the ‘Top 1%’ highest ranking within the Semiconductor and Semiconductor Equipment sector. Last month, we also announced a MoU with Infineon to drive reduction of greenhouse gas emissions across our shared supply chain. With value chain (Scope 3) emissions the largest share of a company’s total emissions, and also the most complex to address, collaboration with our partners is essential as we strive towards our goal of achieving net zero emissions by 2050. We are pleased to join forces with Infineon to accelerate decarbonization action among our common suppliers.”
Summary of Operating Results
Operating Results
(Amount: NT$ million)
1Q26
4Q25
QoQ %
change
1Q25
YoY %
change
Operating Revenues
61,038
61,810
(1.2
)
57,859
5.5
Gross Profit
17,818
18,958
(6.0
)
15,447
15.4
Operating Expenses
(7,099
)
(7,384
)
(3.9
)
(6,123
)
15.9
Net Other Operating Income and Expenses
557
651
(14.5
)
462
20.4
Operating Income
11,276
12,225
(7.8
)
9,786
15.2
Net Non-Operating Income and Expenses
5,367
3,278
63.8
(439
)
-
Net Income Attributable to Shareholders of the Parent
16,171
10,055
60.8
7,777
107.9
EPS (NT$ per share)
1.29
0.81
0.62
(US$ per ADS)
0.204
0.129
0.093
Exchange rate (USD/NTD)
31.63
31.40
33.18
Note:Sums may not equal totals due to rounding.
First quarter operating revenues declined 1.2% sequentially to NT$61.04 billion. Revenue contribution from 40nm and below technologies represented 52% of wafer revenue. Gross profit declined 6.0% QoQ to NT$17.82 billion, or 29.2% of revenue. Operating expenses decreased 3.9% to NT$7.10 billion. Net other operating income decreased 14.5% to NT$0.56 billion. Net non-operating income totaled NT$5.37 billion. Net income attributable to shareholders of the parent amounted to NT$16.17 billion.
Earnings per ordinary share for the quarter was NT$1.29. Earnings per ADS was US$0.204. The basic weighted average number of shares outstanding in 1Q26 was 12,491,206,358, compared with 12,487,002,150 shares in 4Q25 and 12,484,780,989 shares in 1Q25. The diluted weighted average number of shares outstanding was 12,583,475,228 in 1Q26, compared with 12,594,788,681 shares in 4Q25 and 12,579,207,466 shares in 1Q25. The fully diluted shares counted on March 31, 2026 were approximately 12,583,475,000.
Detailed Financials Section
Operating revenues decreased to NT$61.04 billion. COGS increased 0.9% QoQ to NT$43.22 billion. Gross profit decreased 6.0% QoQ to NT$17.82 billion. Operating expenses decreased 3.9% QoQ to NT$7.10 billion, as R&D decreased 7.3% to NT$4.58 billion and G&A decreased 1.0% to NT$1.83 billion, while Sales & Marketing increased 15.8% to NT$0.69 billion. Net other operating income was NT$0.56 billion. In 1Q26, operating income decreased 7.8% QoQ to NT$11.28 billion.
COGS & Expenses
(Amount: NT$ million)
1Q26
4Q25
QoQ %
change
1Q25
YoY %
change
Operating Revenues
61,038
61,810
(1.2
)
57,859
5.5
COGS
(43,219
)
(42,851
)
0.9
(42,412
)
1.9
Depreciation
(13,719
)
(12,991
)
5.6
(12,321
)
11.3
Other Mfg. Costs
(29,500
)
(29,860
)
(1.2
)
(30,091
)
(2.0
)
Gross Profit
17,818
18,958
(6.0
)
15,447
15.4
Gross Margin (%)
29.2
%
30.7
%
26.7
%
Operating Expenses
(7,099
)
(7,384
)
(3.9
)
(6,123
)
15.9
Sales & Marketing
(689
)
(595
)
15.8
(619
)
11.3
G&A
(1,834
)
(1,853
)
(1.0
)
(1,542
)
18.9
R&D
(4,575
)
(4,937
)
(7.3
)
(3,964
)
15.4
Expected Credit Impairment Gain
0
0
2,150.0
2
(98.1
)
Net Other Operating Income & Expenses
557
651
(14.5
)
462
20.4
Operating Income
11,276
12,225
(7.8
)
9,786
15.2
Note:Sums may not equal totals due to rounding.
Net non-operating income in 1Q26 was NT$5.37 billion, primarily reflecting the NT$5.00 billion in net investment gain and the NT$0.30 billion in exchange gain.
Non-Operating Income and Expenses
(Amount: NT$ million)
1Q26
4Q25
1Q25
Non-Operating Income and Expenses
5,367
3,278
(439
)
Net Interest Income and Expenses
88
134
219
Net Investment Gain and Loss
4,997
2,812
(769
)
Exchange Gain and Loss
303
332
115
Other Gain and Loss
(20
)
0
(5
)
Note:Sums may not equal totals due to rounding.
In 1Q26, cash inflow from operating activities was NT$21.98 billion. Cash outflow from investing activities totaled NT$21.35 billion, including NT$13.16 billion in capital expenditures, resulting in free cash flow of NT$8.83 billion. Cash outflow from financing activities was NT$3.69 billion, primarily due to NT$3.04 billion in bank loans. Net cash outflow in 1Q26 amounted to NT$1.64 billion. Over the next 12 months, the company expects to repay NT$6.68 billion in bank loans.
Cash Flow Summary
(Amount: NT$ million)
For the 3-Month Period Ended
Mar. 31, 2026
For the 3-Month Period Ended
Dec. 31, 2025
Cash Flow from Operating Activities
21,981
33,003
Net income before tax
16,644
15,503
Depreciation & Amortization
15,987
15,630
Share of profit of associates and joint ventures
(2,815
)
(929
)
Income tax paid
(464
)
(301
)
Changes in working capital & others
(7,370
)
3,100
Cash Flow from Investing Activities
(21,348
)
(17,059
)
Increase in financial assets measured at amortized cost
(7,101
)
(3,074
)
Acquisition of PP&E
(12,526
)
(14,826
)
Acquisition of investments accounted for under the equity method
(643
)
-
Acquisition of intangible assets
(681
)
(667
)
Others
(397
)
1,508
Cash Flow from Financing Activities
(3,686
)
(11,416
)
Bank loans
(3,039
)
(20,885
)
Bonds issued
-
9,800
Others
(647
)
(331
)
Effect of Exchange Rate
1,411
1,915
Net Cash Flow
(1,641
)
6,443
Beginning balance
110,660
104,217
Ending balance
109,019
110,660
Note:Sums may not equal totals due to rounding.
Cash and cash equivalents decreased to NT$109.02 billion. Days sales outstanding increased 3 days to 50 days, while days of inventory increased 3 day to 80 days.
Current Assets
(Amount: NT$ billion)
1Q26
4Q25
1Q25
Cash and Cash Equivalents
109.02
110.66
106.35
Accounts Receivable
35.60
31.27
34.80
Days Sales Outstanding
50
47
54
Inventories, net
38.65
37.23
35.43
Days of Inventory
80
77
77
Total Current Assets
216.44
204.78
192.32
Current liabilities decreased to NT$79.61 billion. Long-term credit / bonds increased to NT$47.17 billion. Total liabilities decreased to NT$193.20 billion, while debt to equity ratio decreased to 47%.
Liabilities
(Amount: NT$ billion)
1Q26
4Q25
1Q25
Total Current Liabilities
79.61
87.60
72.87
Accounts Payable
9.07
9.17
9.27
Short-Term Credit / Bonds
22.89
27.60
17.63
Payables on Equipment
7.98
11.68
8.46
Other
39.67
39.15
37.51
Long-Term Credit / Bonds
47.17
45.37
44.63
Total Liabilities
193.20
199.14
182.13
Debt to Equity
47%
52%
47%
Analysis of Revenue2
Revenue from Asia Pacific increased to 65%, while business from North America remained at 21% of sales. Business from Europe decreased to 9%, while contribution from Japan increased to 5%.
Revenue Breakdown by Region
Region
1Q26
4Q25
3Q25
2Q25
1Q25
North America
21%
21%
25%
20%
22%
Asia Pacific
65%
64%
63%
67%
66%
Europe
9%
11%
8%
8%
7%
Japan
5%
4%
4%
5%
5%
Revenue contribution from 22/28nm decreased to 34% of wafer revenue, while 40nm contribution increased to 18% of sales.
Revenue Breakdown by Geometry
Geometry
1Q26
4Q25
3Q25
2Q25
1Q25
14nm and below
0%
0%
0%
0%
0%
14nm
US Market News
3月前
HyperLight and UMC Collaborate with Jabil to Bring TFLN Photonics to Data-Center Scale DeploymentMarch 13, 2026 5:03 AM
Business Wire
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a collaboration with Jabil Inc. (“Jabil”), to accelerate the deployment of thin-film lithium niobate (TFLN) photonics into hyperscale AI data center interconnects. The collaboration brings together HyperLight’s TFLN photonic technology, UMC and Wavetek’s qualified foundry manufacturing, and Jabil’s expertise in high-volume manufacturing and assembly to support deployment of next-generation optical modules at data-center scale.
As AI clusters grow, optical interconnects must deliver higher bandwidth without becoming a power bottleneck. HyperLight and Jabil have worked closely to integrate TFLN-based photonic devices into next-generation optical transceiver platforms. Backed by scalable 6-inch and 8-inch wafer manufacturing capabilities of UMC and Wavetek, and leveraging Jabil’s expertise in supply chain management and system integration, this collaboration paves the way for mass market adoption of HyperLight’s TFLN Chiplet™ Platform for energy efficient optical modules suitable for hyperscale data center environments.
“TFLN provides a significant advantage to AI data center networking through reduced power consumption and lower laser requirements,” said Mian Zhang, CEO of HyperLight. “TFLN’s fundamental material benefits only grow as optical interconnect speeds scale. With Jabil driving system integration and manufacturing execution, and with UMC and Wavetek supporting scalable device production, we are moving TFLN from innovation into practical, high-volume deployment for hyperscale data centers today.”
“Hyperscale and AI customers must deploy at scale. They are looking for optical technologies that can be manufactured, integrated, and deployed reliably at data-center volumes,” said Jason Wildt, General Manager and Vice President of Photonics at Jabil. “Our collaboration with HyperLight, UMC, and Wavetek brings together advanced photonics, proven manufacturing at scale, and system integration capabilities, enabling TFLN-based solutions to be deployed at the rack level for AI and hyperscale customers.”
“UMC has supported the transition of TFLN from early development into qualified foundry manufacturing through our work with HyperLight,” said G C Hung, Senior Vice President at UMC. “By extending this collaboration to include system-level integration with Jabil, we are helping establish a complete manufacturing and deployment path that supports the scale, reliability, and capacity requirements of AI data center infrastructure.”
For current-generation optical modules, HyperLight’s TFLN technology can deliver meaningful power savings compared to incumbent approaches, with advantages that strengthen as lane speeds increase. In target architectures, TFLN enables designs that reduce optical complexity, including lower laser count, helping address both power and supply constraints. At hyperscale, these per-module improvements compound into data-center-level power headroom that can be redeployed toward higher GPU density, larger clusters, or incremental AI workloads.
About HyperLight
HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.
Website: https://www.hyperlightcorp.com
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: https://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
View source version on businesswire.com: https://www.businesswire.com/news/home/20260313758941/en/
Media contact
HyperLight
Joe Balaban
joe@hyperlightcorp.com
UMC
Michelle Yun
886-3-578-2258 x16951
michelle_yun@umc.com
Original: HyperLight and UMC Collaborate with Jabil to Bring TFLN Photonics to Data-Center Scale Deployment
US Market News
3月前
HyperLight, UMC, and Wavetek Announce Strategic Partnership for High-Volume Foundry Production of TFLN Chiplet™ PlatformMarch 11, 2026 2:03 PM
Business Wire
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both 6-inch and 8-inch wafers. The collaboration marks a major inflection point in the commercialization of TFLN photonics, enabling the manufacturing capacity required for AI and cloud infrastructure deployment at scale.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260311544174/en/An 8-inch TFLN wafer produced through HyperLight’s TFLN Chiplet™ platform
Designed from inception to enable AI-infrastructure-scale production, the TFLN Chiplet™ Platform unifies the requirements of short-reach IMDD-based data center pluggables, longer-reach coherent-based datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. HyperLight serves as the platform architect, while UMC and Wavetek provide the high-volume foundry manufacturing infrastructure required for global deployment.
Building on HyperLight’s long-standing collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a customer-qualified, high-volume manufacturing (HVM) line within a 6-inch CMOS foundry, UMC is bringing to the partnership its 8-inch production capability and expertise to support the scale required for AI infrastructure growth.
“TFLN has long been recognized as one of the most important technologies for the future of optical interconnects, but the industry has been waiting for a path to true manufacturing scale,” said Mian Zhang, CEO of HyperLight. “The HyperLight TFLN Chiplet Platform was architected from the beginning to unify the requirements of IMDD, coherent, and co-packaged optics into a single manufacturable foundation. The era of TFLN as a niche technology is over. Together with UMC and Wavetek, we are bringing TFLN into high-volume foundry production—enabling the performance, reliability, and cost structure required for AI infrastructure deployment at global scale.”
“To achieve 1.6T bandwidth and beyond, TFLN is emerging as a promising material to deliver the bandwidth requirements for next-generation data center connectivity. UMC is pleased to be a key 8-inch manufacturing partner to bring HyperLight’s scalable platform to the mass market,” said G C Hung, Senior Vice President of UMC. “This partnership sets a new benchmark in the industry and positions the team to lead TFLN production for the rapid growth of AI, cloud, and networking infrastructure.”
“Wavetek has worked closely with HyperLight over the past several years to translate TFLN from a promising material innovation into a qualified, customer-ready high-volume manufacturing line within a CMOS foundry environment,” said Bruce Lai, Chairman of Wavetek. “This announcement marks the next major step—building on that proven foundation to support the volume production and market deployment required for next-generation optical systems. We are proud to continue enabling both high-volume manufacturing and ongoing innovation for TFLN photonics.”
The TFLN Chiplet Platform enables fundamental performance gains including extreme high modulation bandwidth, CMOS-level drive voltage and ultralow optical loss. For AI networks across all interconnect distances, TFLN reduces laser consumption and supports CMOS direct-drive voltage, lowering power consumption as lane speeds continue to scale. For emerging applications like quantum computing and sensing, the TFLN Chiplet platform enables the extreme performance required at scale.
HyperLight’s platform approach consolidates diverse customer requirements into a standardized, production-ready architecture, reducing ecosystem complexity, lowering manufacturing risk, and enabling rapid, cost-competitive adoption of TFLN photonics at global scale.
About HyperLight
HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.
Website: https://www.hyperlightcorp.com
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: https://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
About Wavetek
Wavetek is a wholly owned subsidiary of UMC, providing high-quality compound semiconductors and advanced photonics production. With a focus on gallium nitride (GaN), gallium arsenide (GaAs), thin-film lithium niobate (TFLN), and other specialized compound technologies, Wavetek serves diverse applications including RF, optical interconnects, power electronics, and AI data centers.
Located in Hsinchu, Taiwan, Wavetek is certified with IATF 16949 automotive quality standard, supporting customers worldwide. For more information, please visit: https://www.wtkmicro.com
View source version on businesswire.com: https://www.businesswire.com/news/home/20260311544174/en/
HyperLight
Joe Balaban
info@hyperlightcorp.com
UMC
Michelle Yun
886-3-578-2258 x16951
michelle_yun@umc.com
Original: HyperLight, UMC, and Wavetek Announce Strategic Partnership for High-Volume Foundry Production of TFLN Chiplet™ Platform
US Market News
4月前
UMC Reports Fourth Quarter 2025 ResultsJanuary 28, 2026 10:30 AM
Business Wire
Full-year 22nm revenue increases 93% YoY, reaching record high in Q4 2025
2025 earnings per share of NT$3.34
Fourth Quarter 2025 Overview1:
Revenue: NT$61.81 billion (US$1.97 billion)
Gross margin: 30.7%; Operating margin: 19.8%
Revenue from 22/28nm: 36%
Capacity utilization rate: 78%
Net income attributable to shareholders of the parent: NT$10.06 billion (US$320 million)
Earnings per share: NT$0.81; earnings per ADS: US$0.129
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the fourth quarter of 2025.
Fourth quarter consolidated revenue was NT$61.81 billion, increasing 4.5% from NT$59.13 billion in 3Q25. Compared to a year ago, 4Q25 revenue increased 2.4%. Consolidated gross margin for 4Q25 was 30.7%. Net income attributable to the shareholders of the parent was NT$10.06 billion, with earnings per ordinary share of NT$0.81.
Jason Wang, co-president of UMC, said, “In the fourth quarter, our results were in line with guidance, with flattish wafer shipments amid mild demand across most markets. The 4.5% revenue increase during the quarter was supported by favorable foreign exchange movement as well as sequential growth in our 22/28nm business, which continues to improve our product mix. Within the 22/28nm segment, 22nm revenue increased 31% quarter-on-quarter to a record high, accounting for more than 13% of total fourth-quarter revenue. Looking at the full year, UMC delivered solid performance in 2025, with shipments increasing 12.3% and revenue in US dollars up 5.3% year-on-year.”
“Going into the first quarter of 2026, we expect wafer demand to remain firm. UMC is confident that 2026 will be another growth year as tape-outs on our 22nm platforms accelerate and other new solutions continue to gain business traction.”
Co-president Wang added, “We have been working hard to lay the foundation for our next phase of growth, investing for the future in both capacity and technology. In 2025, we completed the new Phase 3 facility at our Singapore Fab 12i, which is already playing a central role in supporting customers to diversify supply chains. At the same time, we are striving to expand our footprint in the U.S. through innovative yet cost-effective modes of partnerships, such as our 12nm collaboration with Intel and the recently announced MOU with Polar Semiconductor. The leadership UMC has built over the past few years across specialty technologies - including embedded High Voltage, Non-Volatile Memory, and BCD - has and will continue to sustain stable business growth. Looking ahead to 2026 and beyond, we expect advanced packaging and silicon photonics to serve as new growth catalysts, positioning UMC to address the evolving needs of high-performance applications across AI, networking, consumer, automotive and more.”
Co-president Wang said, “During 2025, UMC also reached important milestones in our sustainability journey. Just last month, we officially inaugurated our Circular Economy and Recycling Innovation Center, an on-site waste recycling facility expected to reduce UMC’s total waste generated by Taiwan fabs by up to one-third. This is an important initiative in our goal to enhance resource recovery and develop circular economy solutions in our industry. In addition, UMC continues to be recognized as a leader in international corporate sustainability benchmarks, including the CDP and MSCI ESG Ratings.”
Summary of Operating Results
Operating Results
(Amount: NT$ million)
4Q25
3Q25
QoQ %
change
4Q24
YoY %
change
Operating Revenues
61,810
59,127
4.5
60,386
2.4
Gross Profit
18,958
17,623
7.6
18,343
3.4
Operating Expenses
(7,384
)
(6,973
)
5.9
(6,748
)
9.4
Net Other Operating Income and Expenses
651
467
39.3
362
79.8
Operating Income
12,225
11,118
10.0
11,957
2.2
Net Non-Operating Income and Expenses
3,278
3,526
(7.0
)
(1,443
)
-
Net Income Attributable to Shareholders of the Parent
10,055
14,982
(32.9
)
8,497
18.3
EPS (NT$ per share)
0.81
1.20
0.68
EPS (US$ per ADS)
0.129
0.197
0.104
Exchange rate (USD/NTD)
31.40
30.47
32.78
Note: Sums may not equal totals due to rounding.
Fourth quarter operating revenues grew 4.5% sequentially to NT$61.81 billion. Revenue contribution from 40nm and below technologies represented 53% of wafer revenue. Gross profit increased 7.6% QoQ to NT$18.96 billion, or 30.7% of revenue. Operating expenses increased 5.9% to NT$7.38 billion. Net other operating income increased 39.3% to NT$0.65 billion. Net non-operating income totaled NT$3.28 billion. Net income attributable to shareholders of the parent amounted to NT$10.06 billion.
Earnings per ordinary share for the quarter was NT$0.81. Earnings per ADS was US$0.129. The basic weighted average number of shares outstanding in 4Q25 was 12,487,002,150, compared with 12,485,162,809 shares in 3Q25 and 12,481,192,676 shares in 4Q24. The diluted weighted average number of shares outstanding was 12,594,788,681 in 4Q25, compared with 12,556,345,829 shares in 3Q25 and 12,610,756,874 shares in 4Q24. The fully diluted shares counted on December 31, 2025 were approximately 12,598,993,000.
Detailed Financials Section
Operating revenues increased to NT$61.81 billion. COGS increased 3.2% QoQ to NT$42.85 billion. Gross profit increased 7.6% to NT$18.96 billion. Operating expenses grew 5.9% QoQ to NT$7.38 billion, as G&A increased 8.1% to NT$1.85 billion and R&D increased 6.6% to NT$4.94 billion, while Sales & Marketing decreased 5.3% to NT$0.60 billion. Net other operating income was NT$0.65 billion. In 4Q25, operating income increased 10.0% QoQ to NT$12.23 billion.
COGS & Expenses
(Amount: NT$ million)
4Q25
3Q25
QoQ %
change
4Q24
YoY %
change
Operating Revenues
61,810
59,127
4.5
60,386
2.4
COGS
(42,851
)
(41,504
)
3.2
(42,043
)
1.9
Depreciation
(12,991
)
(12,635
)
2.8
(11,841
)
9.7
Other Mfg. Costs
(29,860
)
(28,869
)
3.4
(30,202
)
(1.1
)
Gross Profit
18,958
17,623
7.6
18,343
3.4
Gross Margin (%)
30.7
%
29.8
%
30.4
%
Operating Expenses
(7,384
)
(6,973
)
5.9
(6,748
)
9.4
Sales & Marketing
(595
)
(628
)
(5.3
)
(623
)
(4.6
)
G&A
(1,853
)
(1,715
)
8.1
(1,791
)
3.5
R&D
(4,937
)
(4,631
)
6.6
(4,334
)
13.9
Expected Credit Impairment Gain
0
0
0.0
0
(99.5
)
Net Other Operating Income & Expenses
651
467
39.3
362
79.8
Operating Income
12,225
11,118
10.0
11,957
2.2
Note: Sums may not equal totals due to rounding.
Net non-operating income in 4Q25 was NT$3.28 billion, primarily reflecting the NT$2.81 billion in net investment gain and the NT$0.33 billion in exchange gain.
Non-Operating Income and Expenses
(Amount: NT$ million)
4Q25
3Q25
4Q24
Non-Operating Income and Expenses
3,278
3,526
(1,443
)
Net Interest Income and Expenses
134
88
290
Net Investment Gain and Loss
2,812
3,192
(2,614
)
Exchange Gain and Loss
332
250
877
Other Gain and Loss
0
(3
)
4
Note: Sums may not equal totals due to rounding.
In 4Q25, cash inflow from operating activities was NT$33.00 billion. Cash outflow from investing activities totaled NT$17.06 billion, including NT$15.62 billion in capital expenditures, resulting in free cash flow of NT$17.38 billion. Cash outflow from financing activities was NT$11.42 billion, primarily due to NT$20.89 billion in bank loans, partially offset by NT$9.80 billion in bonds issued. Net cash inflow in 4Q25 amounted to NT$6.44 billion. Over the next 12 months, the company expects to repay NT$12.48 billion in bank loans.
Cash Flow Summary
(Amount: NT$ million)
For the 3-Month Period Ended
Dec. 31, 2025
For the 3-Month Period Ended
Sep. 30, 2025
Cash Flow from Operating Activities
33,003
20,938
Net income before tax
15,503
14,644
Depreciation & Amortization
15,630
14,995
Share of profit of associates and joint ventures
(929
)
(1,250
)
Income tax paid
(301
)
(3,341
)
Changes in working capital & others
3,100
(4,110
)
Cash Flow from Investing Activities
(17,059
)
(16,152
)
Increase in financial assets measured at amortized cost
(3,074
)
(4,043
)
Acquisition of PP&E
(14,826
)
(11,223
)
Acquisition of intangible assets
(667
)
(948
)
Others
1,508
62
Cash Flow from Financing Activities
(11,416
)
(15,160
)
Bank loans
(20,885
)
15,874
Bonds issued
9,800
5,000
Cash dividends
-
(35,788
)
Others
(331
)
(246
)
Effect of Exchange Rate
1,915
2,597
Net Cash Flow
6,443
(7,777
)
Beginning balance
104,217
111,994
Ending balance
110,660
104,217
Note: Sums may not equal totals due to rounding.
Cash and cash equivalents increased to NT$110.66 billion. Days sales outstanding decreased 3 days to 47 days, while days of inventory increased 1 day to 77 days.
Current Assets
(Amount: NT$ billion)
4Q25
3Q25
4Q24
Cash and Cash Equivalents
110.66
104.22
105.00
Accounts Receivable
31.27
32.25
33.34
Days Sales Outstanding
47
50
51
Inventories, net
37.23
35.18
35.78
Days of Inventory
77
76
80
Total Current Assets
204.78
192.85
189.68
Current liabilities increased to NT$88.90 billion. Long-term credit / bonds decreased to NT$45.37 billion. Total liabilities increased to NT$199.14 billion, while debt to equity ratio decreased to 52%.
Liabilities
(Amount: NT$ billion)
4Q25
3Q25
4Q24
Total Current Liabilities
88.90
82.28
75.26
Accounts Payable
9.17
8.04
7.63
Short-Term Credit / Bonds
27.60
30.15
19.51
Payables on Equipment
11.68
11.57
10.52
Other
40.45
32.52
37.60
Long-Term Credit / Bonds
45.37
53.76
55.53
Total Liabilities
199.14
194.20
192.02
Debt to Equity
52
%
54
%
51
%
Analysis of Revenue2
Revenue from Asia Pacific increased to 64%, while business from North America decreased to 21% of sales. Business from Europe increased to 11%, while contribution from Japan was 4%.
Revenue Breakdown by Region
Region
4Q25
3Q25
2Q25
1Q25
4Q24
North America
21
%
25
%
20
%
22
%
25
%
Asia Pacific
64
%
63
%
67
%
66
%
61
%
Europe
11
%
8
%
8
%
7
%
11
%
Japan
4
%
4
%
5
%
5
%
3
%
Revenue contribution from 22/28nm was increased to 36% of wafer revenue, while 40nm contribution remained at 17% of sales.
Revenue Breakdown by Geometry
Geometry
4Q25
3Q25
2Q25
1Q25
4Q24
14nm and below
0
%
0
%
0
%
0
%
0
%
14nm
NathanH
11年前
Infineon and UMC Announce Manufacturing Agreement for Automotive Applications
Source: PR Newswire (US)
HSINCHU, Taiwan, Dec. 15, 2014 /PRNewswire/ -- The semiconductor manufacturer Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today announced the extension of their manufacturing partnership into power semiconductors for automotive applications. Prior to this expanded partnership, the foundry had been producing Infineon's logic chips for more than 15 years. Based on the recently signed agreement, both companies will jointly transfer Infineon's automotive-qualified Smart Power Technology (SPT9) to UMC and extend its production to 300mm wafers. Production start of SPT9 products at UMC's 300mm Fab in Taiwan is planned for early 2018.
SPT9 is a proprietary 130-nanometer (nm) process technology of Infineon that combines microcontroller intelligence and power technology on a single die.
"We are proud to announce this milestone in our partnership with Infineon to bring SPT9 into UMC's technology roadmap," said Po-Wen Yen, CEO of UMC. "Automotive applications are a key priority for our technology, capacity and customers, and we are pleased to extend our collaboration with Infineon into state-of-the-art power semiconductors for automotive applications. With our strong manufacturing excellence, UMC is capable of meeting the highest-rated Grade 0 automotive industry quality standards. We are fully committed to the stringent quality requirements of the automotive industry to meet the market requirements for automotive IC suppliers such as Infineon."
"We trust in UMC to master the demanding automotive obligations of Infineon as an innovative and reliable source providing long-term and stable supply," says Jochen Hanebeck, President, Automotive division at Infineon Technologies AG. "We are a technology leader in automotive power applications with strong system expertise. With SPT9, Infineon enables power semiconductors of an unmatched level of integration."
SPT9's highly integrated system solutions approach for automotive electronics
In order to satisfy the demands of automotive applications for more functionality and safety as well as compact and cost-optimized solutions, an increasing amount of digital logic is required in power semiconductors. In 2009, Infineon was the world's first semiconductor manufacturer to offer an automotive-qualified embedded power technology in 130nm technology node that combines complex digital logic circuits, sensor interfaces and power electronics. Combining building blocks that are actually manufactured in three different production process technologies enables semiconductor devices that are highly integrated and take over many tasks of other system components. Since fewer components are required in the application, the vulnerability of automotive control systems to faults is reduced. With SPT9, even semiconductors offering massive functionality are very small in size. SPT9 applications are varied, ranging from intelligent control for small electric motors in vehicles, such as used for power window lifts, wipers, sun roofs, power seats and fan/blower control, oil and water pumps, to airbags, and audio amplifiers.
Market Positioning
UMC is a world leading semiconductor foundry, with annual revenues exceeding US $4 billion.
In the 2013 global automotive semiconductor market, worth US $25.1 billion, Infineon is ranked number two with a 9.6 percent market share.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: Energy efficiency, mobility, and security. In the 2014 fiscal year (ending September 30), the company reported sales of Euro 4.3 billion with close to 29,800 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
Further information is available at www.infineon.com
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
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