TSMC Files Annual Report on Form 20-F for 2023
2024年4月18日 - 8:03PM
ビジネスワイヤ（英語）
TSMC (TWSE: 2330, NYSE: TSM) today filed its 2023 annual report
on Form 20-F with the U.S. Securities and Exchange Commission.
The report is available at
https://investor.tsmc.com/english/sec-filings. Hard copies of the
report are also available, free of charge, upon email request to
p_sec_service@tsmc.com.
About TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987 and has been the world’s leading dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s
leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North
America, TSMC serves as a committed corporate citizen around the
world.
TSMC deployed 288 distinct process technologies, and
manufactured 11,895 products for 528 customers in 2023 by providing
broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu,
Taiwan. For more information please visit https://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20240418694629/en/
TSMC Spokesperson: Wendell
Huang Senior Vice President and CFO Tel: 886-3-505-5901
Media Contacts: Nina Kao
Head of Public Relations Tel: 886-3-563-6688 ext.712-5036 Mobile:
886-988-239-163 E-Mail: nina_kao@tsmc.com
Ulric Kelly Public Relations Tel: 886-3-563-6688 ext.712-6541
Mobile: 886-978-111-503 E-Mail: ukelly@tsmc.com
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