STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors
2024年2月22日 - 11:00PM
STMicroelectronics expands into 3D depth
sensingwith latest time-of-flight
sensors
- Building on a leading position in direct Time-of-Flight
sensors, with two billion FlightSense™ devices sold, ST reveals new
direct and indirect Time-of-Flight sensors for key applications
like camera assist, virtual reality, 3D webcam, robotics and smart
buildings
- Market-first true all-in-one dToF LiDAR module with up to 2.3k
zones, targets smartphone camera-assist and AR/VR applications
- The world’s smallest iToF sensor with 672x804-pixel
resolution, is now in volume production with a first design win at
Lanxin Technology
Geneva, Switzerland, February 22, 2024 –
STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics
applications, announced an all-in-one, direct Time-of-Flight (dToF)
3D LiDAR (Light Detection And Ranging) module with market-leading
2.3k resolution, and revealed an early design win for the world's
smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
“ToF sensors, which can accurately measure the distance to
objects in a scene, are driving exciting new capabilities in smart
devices, home appliances, and industrial automation. We have
already delivered two billion sensors into the market and continue
to extend our unique portfolio, which covers all types from the
simplest single-zone devices up to our latest high-resolution 3D
indirect and direct ToF sensors,” said Alexandre Balmefrezol,
General Manager, Imaging Sub-Group at STMicroelectronics. “Our
vertically integrated supply chain, covering everything from pixel
and metasurface lens technology and design to fabrication, with
geographically diversified in-house high-volume module assembly
plants, lets us deliver extremely innovative, highly integrated,
and high-performing sensors.”
The VL53L9, announced today, is a new direct ToF 3D LiDAR device
with a resolution of up to 2.3k zones. Integrating a dual scan
flood illumination, unique in the market, the LiDAR can detect
small objects and edges and captures both 2D infrared (IR) images
and 3D depth map information. It comes as a ready-to-use low power
module with its on-chip dToF processing, requiring no extra
external components or calibration. Additionally, the device
delivers state-of-the-art ranging performance from 5cm to 10
meters.
VL53L9’s suite of features elevates camera-assist performance,
supporting macro up to telephoto photography. It enables features
such as laser autofocus, bokeh, and cinematic effects for still and
video at 60fps (frame per second). Virtual reality (VR) systems can
leverage accurate depth and 2D images to enhance spatial mapping
for more immersive gaming and other VR experiences like virtual
visits or 3D avatars. In addition, the sensor’s ability to detect
the edges of small objects at short and ultra-long ranges makes it
suitable for applications such as virtual reality or SLAM
(simultaneous localization and mapping).
ST is also announcing news of its VD55H1 ToF sensor, including
the start of volume production and an early design win with Lanxin
Technology, a China-based company focusing on mobile-robot
deep-vision systems. MRDVS, a subsidiary company, has chosen the
VD55H1 to add high-accuracy depth-sensing to its 3D cameras. The
high-performance, ultra-compact cameras with ST’s sensor inside
combine the power of 3D vision and edge AI, delivering intelligent
obstacle avoidance and high-precision docking in mobile robots.
In addition to machine vision, the VD55H1 is ideal for 3D
webcams and PC applications, 3D reconstruction for VR headsets,
people counting and activity detection in smart homes and
buildings. It packs 672 x 804 sensing pixels in a tiny chip size
and can accurately map a three-dimensional surface by measuring
distance to over half a million points. ST’s stacked-wafer
manufacturing process with backside illumination enables
unparalleled resolution with smaller die size and lower power
consumption than alternative iToF sensors in the market. These
characteristics give the sensors their excellent credentials in 3D
content creation for webcams and VR applications including virtual
avatars, hand modeling and gaming.
First samples of the VL53L9 are already available for lead
customers and mass production is scheduled for early 2025. The
VD55H1 is in full production now.
Pricing information and sample requests are available at local
ST sales offices.
ST will showcase a range of ToF sensors including the VL53L9 and
explain more about its technologies at Mobile World Congress 2024,
in Barcelona, February 26-29, at booth 7A61.
Notes to Editors
Time-of-flight (ToF) sensors use photon travel time between two
points to calculate the distance between those points.
3D ToF depth sensors provide a map of ranging information
computing the distance to multiple objects in the field-of-view.
With flood illumination, 3D sensors are also able to acquire an IR
2D frame used to improve the post-processing and so enrich the user
experience. 3D ToF sensors can map a scene for robot navigation and
collision avoidance, detect and localize objects or people for
smart building applications such as room-usage analysis and
emergency assistance. Combining a 3D ToF rendering with the output
of a color image sensor gives the opportunity to create truly
immersive virtual reality experiences.
The VD55H1 calculates the distance to points on a surface by
measuring the phase shift between its emitted signal and the
received, reflected signal. This indirect Time-of-Flight (iToF)
sensing is a complementary technique to direct Time-of-Flight
(dToF) sensing used by sensors like the VL53L9, which measures the
time between transmitting and receiving the reflected signals. ST’s
broad portfolio of advanced technologies enables the Company to
design both direct and indirect high-resolution ToF sensors, and
offer optimized solutions tailored to application requirements.
About STMicroelectronicsAt ST, we are over
50,000 creators and makers of semiconductor technologies mastering
the semiconductor supply chain with state-of-the-art manufacturing
facilities. An integrated device manufacturer, we work with more
than 200,000 customers and thousands of partners to design and
build products, solutions, and ecosystems that address their
challenges and opportunities, and the need to support a more
sustainable world. Our technologies enable smarter mobility, more
efficient power and energy management, and the wide-scale
deployment of cloud-connected autonomous things. We are committed
to achieving our goal to become carbon neutral on scope 1 and 2 and
partially scope 3 by 2027. Further information can be found at
www.st.com.
For Press Information Contact:
Alexis
Breton Corporate
External CommunicationsTel:
+33.6.59.16.79.08alexis.breton@st.com
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- P4608D -- Feb 22 2024 -- VD55H1 and VL53L9 ToF
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STMicroelectronics NV (NYSE:STM)
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