Aehr Test Systems (AEHR)

Aehr Receives Follow-On Production Order from Lead Silicon Photonics Customer for Fully Automated FOX-XP Wafer-Level Burn-In SystemJuly 9, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / July 9, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received an additional follow-on production order from its lead silicon photonics customer for a fully automated FOX-XP® wafer-level burn-in (WLBI) system. The system will support high-volume production burn-in of silicon photonics devices used in AI optical interconnect and hyperscale data center applications.The order includes Aehr's turnkey FOX-XP multi-wafer WLBI system configured to test up to nine 300mm wafers in parallel together with the fully automated FOX WaferPak® AutoAligner™, enabling automated, high-volume production burn-in with hands-free operation when integrated with an automated wafer handler.The customer is developing advanced silicon photonics devices used in next-generation optical interconnects and optical I/O architectures for hyperscale AI and cloud data centers and advanced packaging of AI processors and high-performance computing (HPC) devices. These silicon photonics devices enable dramatically higher bandwidth and lower power communication between AI processors, memory, switches, and networking equipment, addressing one of the industry's most significant bottlenecks as AI infrastructure continues to scale. Industry leaders across the AI ecosystem have increasingly identified silicon photonics and optical I/O as key enabling technologies for future AI clusters, rack-scale computing, and chip-to-chip communications to permanently replace copper interconnects that are approaching their practical performance and power limits.This customer took delivery of its first FOX-XP with fully automated WaferPak Aligner production system in fiscal 2026. The system has now been successfully installed and demonstrated fully automated, hands-free operation integrated with the customer's automated wafer handling equipment and an automated guided vehicle for 300mm wafer FOUP movement. This represents an important production milestone as the customer ramps up manufacturing of its silicon photonics products."The successful installation and production qualification of our first fully-automated system with this customer represents another important milestone in our long-term relationship with them," said Gayn Erickson, President and CEO of Aehr Test Systems. "Demonstrating fully hands-free production operation with our integrated FOX-XP platform and automated wafer handling validates not only our technology, but also our ability to support customers as they transition from engineering qualification into high-volume manufacturing."We are very pleased to receive this additional follow-on production order early in our new fiscal year. We believe this order reflects the customer's continued confidence in Aehr's FOX-XP platform and represents an encouraging start to fiscal 2027. As AI infrastructure evolves toward optical interconnects and optical I/O, we believe Aehr is well-positioned to support customers that require cost-effective, high-throughput WLBI and stabilization."Demand for silicon photonics continues to accelerate as hyperscale AI infrastructure expands. Major technology companies and AI infrastructure providers are increasingly adopting optical interconnect technologies to overcome the bandwidth, latency, and power limitations of traditional electrical interconnects. Industry forecasts anticipate significant growth in silicon photonics deployments over the coming years as optical communication moves closer to AI processors and ultimately onto processor packages through optical I/O architectures.Aehr's FOX-XP platform is designed for high-power wafer-level test and burn-in of advanced semiconductor devices, including silicon photonics integrated circuits, AI processors, power semiconductors, memory devices, sensors, and other leading-edge semiconductor technologies. The FOX-XP system enables parallel burn-in and test of up to nine wafers simultaneously and, when combined with the FOX WaferPak AutoAligner, provides a fully automated production solution that significantly reduces handling time while improving throughput, repeatability, and manufacturing efficiency. The platform utilizes Aehr's proprietary FOX WaferPak Contactors, allowing full-wafer electrical contact and burn-in before singulation to identify infant mortality failures, improve long-term reliability, and lower overall manufacturing costs.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Aehr Test Systems PondelWilkinson, Inc.Vernon Rogers Todd Kehrli or Jim ByersEVP of Sales & Marketing Analyst/Investor Contactvrogers@aehr.com tkehrli@pondel.com jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Follow-On Production Order from Lead Silicon Photonics Customer for Fully Automated FOX-XP Wafer-Level Burn-In System

It isn't that hard to believe this has lost almost half its value in a couple of weeks.

Or the possibility that it will lose another half just as quickly...

Aehr Test Systems to Announce Fiscal 2026 Fourth Quarter and Full Year Financial Results on July 14, 2026July 7, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / July 7, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications,today announced that it will report financial results for its fiscal 2026 fourth quarter and full year ended May 29, 2026 on Tuesday, July 14, 2026 following the close of the market. The Company will host a conference call and webcast at 5:00 p.m. Eastern time to discuss the results.What: Aehr Test Systems fiscal 2026 fourth quarter and full year financial results.When: Tuesday, July 14, at 5:00 p.m. Eastern Time (2:00 p.m. PT).Dial in Number: To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 222496.Webcast: To access the live webcast, please visit the investor relations section at www.aehr.com.Call Replay: A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 54119.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.# # #Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Announce Fiscal 2026 Fourth Quarter and Full Year Financial Results on July 14, 2026

Aehr Test Systems Shares Climb on New Silicon Photonics Production OrderJune 17, 2026 9:04 AM
IH Market News Aehr Test Systems (NASDAQ:AEHR) advanced 11% after announcing a follow-on production order for one of its FOX-XP wafer-level burn-in systems from a major customer operating in the silicon photonics market. The order highlights growing demand for semiconductor testing equipment tied to the rapid expansion of artificial intelligence infrastructure and next-generation data center technologies. New System Designed for High-Volume Wafer Testing The FOX-XP system included in the order is configured to test nine wafers simultaneously and features a fully integrated WaferPak Auto Aligner alongside a complete set of FOX WaferPak Contactors. Aehr said the system is expected to be delivered within the next six months. The equipment is intended to support high-volume production environments where reliability and throughput are critical. Customer Expanding Capacity for AI Data Centers The customer was described as a global provider of networking products and a major supplier to the optical transceiver market serving data centers. The company is developing advanced silicon photonics transceivers for networking and optical input/output applications, technologies that are increasingly important as hyperscale AI and cloud computing operators deploy faster fiber-optic communication infrastructure. Aehr also disclosed that the customer has provided projections for additional system purchases later this year as production capacity expands to support future hyperscale deployments. Management Sees Strong Momentum in AI Infrastructure Buildout Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems, said the latest order underscores the pace at which customers are increasing production. “This order reflects the urgency of the production ramp now underway to support the massive buildout of hyperscale AI and cloud data centers.” Management believes rising investment in AI infrastructure is creating substantial demand for advanced semiconductor testing and burn-in solutions. Rapid Progress From Initial Engagement to Production Aehr noted that it began working with the customer approximately seven months ago with the goal of reaching volume production within six months. Since then, the company has supplied one full production system and two engineering systems, all of which had been delivered by May. The swift progression from initial engagement to production deployment reflects the customer’s accelerated timeline for expanding manufacturing capacity. Growing Adoption of FOX Platform The latest order adds to the expanding deployment of Aehr’s FOX wafer-level testing systems across the semiconductor industry. According to the company, more than 25 customers have now adopted FOX platforms for testing applications spanning artificial intelligence, silicon photonics, automotive, industrial and data center markets. As demand for high-performance semiconductor devices continues to rise, Aehr expects advanced test and burn-in technologies to remain a key part of the production process for next-generation chips and optical components. Aehr Test Systems stock priceThe post Aehr Test Systems Shares Climb on New Silicon Photonics Production Order appeared first on US Editors. Original: Aehr Test Systems Shares Climb on New Silicon Photonics Production Order

Aehr Receives Follow-On Order From Major Silicon Photonics Customer for Fully Automated Wafer-Level Burn-In System for Hyperscale Data Center Optical InterconnectJune 17, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / June 17, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a follow-on production order for a fully automated FOX-XP™ wafer-level burn-in (WLBI) system. The system is configured to test nine wafers in parallel, and includes a fully integrated WaferPak™ Auto Aligner, and a full set of FOX WaferPak Contactors. The system is scheduled for delivery within the next six months.This customer is a global leader in networking products and solutions and a major supplier to the data center optical transceiver market. The customer is developing advanced silicon photonics-based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers. The customer has also provided Aehr with a forecast for additional systems this calendar year as it ramps capacity to support next generation hyperscale data center deployments."We are excited to receive this follow-on order for a full production FOX WLBI test cell, which reflects the urgency of the production ramp now underway to support the massive buildout of hyperscale AI and cloud data centers," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "This customer is a leading supplier of networking products and solutions for the data center market, and we are pleased to support its capacity expansion plans as it prepares for next-generation hyperscale data center deployments."We first engaged with this customer only seven months ago with an objective to move quickly to volume production within six months. Aehr was able to demonstrate the production-ready capabilities of our fully integrated test cell to meet the customer's performance and throughput requirements in a remarkably short period of time. This enabled us to deliver a full production system and two engineering systems to them by May, meeting their goal. By leveraging our FOX wafer-level systems installed base, which has now been deployed to more than 25 customers, we believe we are well positioned to help customers move efficiently from qualification to production in a very short period."Data center architectures are rapidly evolving as AI infrastructure scales, driving a major transition from traditional copper interconnects to fiber optic communication links to meet the increasing requirements for bandwidth, latency, signal integrity, thermal performance, and power efficiency. Silicon photonics-based optical transceivers are a critical enabling technology for this transformation. We believe Aehr is well positioned to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers."This customer engagement further validates wafer-level burn-in as an increasingly important part of silicon photonics manufacturing flow and highlights the potential for silicon photonics to become a meaningful long-term growth driver for Aehr's WLBI business. With our leadership in WLBI for silicon photonics and our ability to support customers for qualification through high-volume production, we believe Aehr offers the industry's most cost-effective solution for this rapidly emerging market."As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume.Aehr is the market leader in WLBI for silicon photonics transceivers, with a large installed base at leading global semiconductor and photonics companies. The Company's FOX-XP platform enables high-parallelism, high-temperature, and high-power WLBI, with the unique ability to precisely maintain devices at the required temperature to enable highly effective burn-in, allowing customers to identify early-life failures before packaging while significantly reducing cost of test.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Follow-On Order From Major Silicon Photonics Customer for Fully Automated Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect

Aehr Test Systems to Present at William Blair 46th Annual Growth Stock Conference on June 2May 28, 2026 4:05 PM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / May 28, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that that President and CEO Gayn Erickson and CFO Chris Siu will be presenting at the William Blair 46th Annual Growth Stock Conference in Chicago on Tuesday, June 2 at 4:40pm CT (2:40pm PT)and will be meeting with institutional investors throughout the day.You may register to access a live or replay audio webcast of the presentation via a link posted to the investor relations section of Aehr's website at www.aehr.com or by clicking here."We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."For additional information, or to schedule a meeting with Aehr management, please contact your William Blair representative, or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.# # #Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Present at William Blair 46th Annual Growth Stock Conference on June 2

Aehr Test Systems to Participate in the 23rd Annual Craig-Hallum Institutional Investor Conference on May 28May 21, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / May 21, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that CFO Chris Siu will be participating in one-on-one meetings with institutional investors at the 23rd Annual Craig-Hallum Institutional Investor Conference taking place Thursday, May 28, 2026 at the Depot Renaissance Hotel in Minneapolis.For additional information, or to schedule a meeting with Aehr Test Systems, please contact your Craig-Hallum representative, or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Participate in the 23rd Annual Craig-Hallum Institutional Investor Conference on May 28

144 sales.

There are a lot of things about AEHR that are head scratchers. Almost a $3B market cap, for one...

Analysts price targets are in the 60's. Clearly overpriced here.

https://investorshub.advfn.com/stock-market/NASDAQ/aehr-test-systems-AEHR/stock-news/98319168/form-144-report-of-proposed-sale-of-securities

Aehr Test Systems Jumps on Record AI Chip Order Worth $41MApril 16, 2026 10:14 AM
IH Market News
Aehr Test Systems (NASDAQ:AEHR) shares surged 14% on Thursday after the company announced a record-breaking $41 million production order from its leading hyperscale AI customer, focused on package-level burn-in testing for custom AI processor ASICs.The contract, the largest in Aehr’s history, covers Sonoma high-power package-level test and burn-in systems, as well as burn-in modules and device-specific sockets. Shipments are scheduled to begin in fiscal 2027, which starts on June 27, 2026.With this latest deal, Aehr’s bookings for the second half have now surpassed $92 million, with six weeks still remaining in the fourth quarter. This figure exceeds the company’s recently raised guidance of $60 million to $80 million for the period. The equipment will be used to support high-volume burn-in testing of ASICs deployed in AI data center training and inference applications.President and CEO Gayn Erickson said the order underscores the capability of the Sonoma platform for large-scale production testing of very high-power AI processor ASICs. He added that the same customer is also developing a next-generation, higher-power AI accelerator ASIC, expected to enter production later this year, and has already placed an initial order for multiple Sonoma systems.Aehr recently expanded its Fremont, California facility, adding additional power capacity, cooling systems, and clean-room manufacturing space. The company also noted that it will begin delivering Sonoma systems from an upgraded contract manufacturing site this quarter, with the ability to produce more than 20 additional systems per month.Looking ahead, Aehr said it sees strong pipeline demand across several markets, including AI processor burn-in, silicon photonics, and burn-in testing for silicon carbide and gallium nitride power semiconductors.Aehr Test Systems stock price

Original: Aehr Test Systems Jumps on Record AI Chip Order Worth $41M

Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer; Second-Half Bookings Exceed $92 MillionApril 16, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / April 16, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a record $41 million follow-on production order from its lead hyperscale customer for package-level burn-in (PLBI) of custom AI processor ASICs. The order is the largest in Aehr's history and supports high-volume production burn-in of ASICs used in data center training and inference AI workloads.The order includes a large quantity of Aehr's Sonoma™ high-power package-level test and burn-in systems, along with fully turnkey burn-in modules (BIMs) and device-specific sockets - the consumables required to configure the Sonoma systems for the customer's specific AI processor. Deliveries under the order are expected to begin in Aehr's fiscal 2027, which starts on June 27, 2026."This $41 million follow-on order from our lead hyperscale package-level burn-in customer brings our bookings in the second half of our fiscal year to more than $92 million to date with six weeks remaining in the fourth quarter and a strong pipeline of forecasted customer orders in place," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "This order further validates our Sonoma platform for high-volume production burn-in of very-high-power AI processor ASICs. Our Sonoma systems first entered production with this customer last year, and this new order reflects their continued ramp in capacity for current-generation devices."This customer is also developing a significantly higher-power AI accelerator ASIC expected to move to production later this year, and they have already placed an initial order with us for multiple Sonoma systems to be used for production for that device. As these next-generation devices move into volume production, we see the potential for further substantial increases in demand for Sonoma systems and consumables in our next fiscal year."Hyperscale cloud providers are increasingly designing custom AI accelerator ASICs to optimize performance, power efficiency, and total cost of ownership for large-scale AI training and inference workloads. Industry analysts project that shipments of hyperscale-designed AI processors will grow at a compound annual growth rate exceeding 30% through 2030, driven by the rapid adoption of generative AI, large language models, and AI-enabled services across cloud computing, enterprise, and consumer applications. As AI processor power levels and integration complexity continue to increase, Aehr believes demand for high-power production burn-in solutions will scale accordingly, expanding the market opportunity for Aehr's Sonoma platform."With this order, Aehr has now booked over $92 million in orders in the second half of this fiscal year, already exceeding our recently increased expectations, which we provided last week, for bookings on the high side of $60 million to $80 million during this period. We also have significant additional customer demand forecasted over the next few months across multiple markets, including AI processor wafer-level and packaged-part production burn-in, silicon photonics wafer-level burn-in, and silicon carbide and gallium nitride power semiconductor wafer-level production burn-in, and we expect a portion of this demand to convert into bookings before the end of this fiscal year. These bookings, together with the growing number and breadth of customer engagements across these market segments, as well as flash and high bandwidth memory, give us improved visibility and increased confidence in significant revenue growth in fiscal 2027 and beyond."To support growing customer demand, Aehr recently completed a significant facility expansion, adding power, cooling infrastructure, and clean-room manufacturing space in our Fremont, California facility. In addition, this quarter we will begin shipping Sonoma systems from a newly upgraded contract manufacturing facility, with capacity for more than 20 additional systems per month. These upgrades meaningfully increase our production capacity and allow us to support very significant growth in shipments of both our Sonoma package-level and FOX™ wafer-level test and burn-in systems, as well as the associated consumables."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer; Second-Half Bookings Exceed $92 Million

Aehr Test Systems Reports Over $37 Million in Quarterly Bookings Driven by Strong AI and Data Center Infrastructure DemandApril 7, 2026 4:05 PM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / April 7, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced financial results for its third quarter of fiscal 2026, ended February 27, 2026.The company reported strong quarterly bookings of $37.2 million, representing a book-to-bill ratio of over 3.5x, reflecting strong customer demand across both wafer-level burn-in (WLBI) and package-level burn-in (PLBI) applications. The company expects a significant near-term follow-on production order from its lead hyperscale customer for PLBI systems for custom AI processors and now expects bookings to be on the high end of the previously stated range of $60 million to $80 million in its fiscal 2026 second half ending May 29, 2026.Fiscal Third Quarter Financial Results:Net revenue was $10.3 million, compared to $18.3 million in the third quarter of fiscal 2025.GAAP net loss was $(3.2) million, or $(0.10) per diluted share, compared to GAAP net loss of $(0.6) million, or $(0.02) per diluted share, in the third quarter of fiscal 2025.Non-GAAP net loss, which excludes stock-based compensation and acquisition-related adjustments, was $(1.5) million, or $(0.05) per diluted share, compared to non-GAAP net income of $2.0 million, or $0.07 per diluted share, in the third quarter of fiscal 2025.Bookings were $37.2 million for the quarter.Backlog as of February 27, 2026 was $38.7 million. Effective backlog, including bookings since February 27, 2026, is $50.9 million.Total cash, cash equivalents and restricted cash as of February 27, 2026 was $37.1 million, compared to $31.0 million on November 28, 2025.Fiscal First Nine Months Financial Results:Net revenue was $31.2 million, compared to $44.9 million in the first nine months of fiscal 2025.GAAP net loss was $(8.5) million, or $(0.28) per diluted share, compared to GAAP net loss of $(1.0) million, or $(0.03) per diluted share, during the first nine months of fiscal 2025.Non-GAAP net loss was $(2.6) million, or $(0.09) per diluted share, which excludes stock-based compensation, acquisition-related adjustments and restructuring charges, compared to non-GAAP net income of $4.8 million, or $0.16 per diluted share, in the first nine months of fiscal 2025.Cash used in operating activities was $5.1 million for the first nine months of fiscal 2026.An explanation of the use of non-GAAP financial measures and a reconciliation of Aehr's non-GAAP financial measures to the most directly comparable GAAP financial measures can be found in the accompanying tables.Gayn Erickson, President and CEO of Aehr Test Systems, commented:"We are very pleased with the strong momentum in our business across multiple market segments, highlighted by more than $37 million in quarterly bookings and a book-to-bill ratio exceeding 3.5x. Demand continues to accelerate across both WLBI and PLBI as semiconductor devices grow in size, complexity, and power and are increasingly deployed in mission-critical AI, networking, automotive, and industrial applications."During the quarter, we continued to make progress in growing the business and expanding our customer base in our WLBI business. For AI processors, we received a production WLBI order from our lead AI processor customer for multiple new fully automated FOX-XP WLBI systems to be used in data center training and inference applications. We have several other companies ranging from suppliers of data center-focused AI accelerator processors to Edge AI processors and CPUs that are providing us with information on their devices and roadmaps and asking about our WLBI capabilities and recommendations for burn-in of their next generation devices. There is significant interest in doing WLBI for devices that are expected to be put in advanced packages such as CoWoS that include other die such as HBM DRAM stacks, other compute AI processors, and photonic or electrical-based transceiver chipsets. Weeding out bad devices before they are packaged together with these other devices is significantly cheaper than the yield loss if these are burned in at packaged level and the entire multi-chip package is thrown away."Silicon photonics is a market we see significant opportunity for WLBI. We recently announced a major new customer win with our high-power FOX-XP WLBI system for devices aimed at hyperscale data center optical interconnect market. This was an initial order for multiple FOX systems for both qualification and production. The customer is developing advanced silicon photonics-based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers. We believe this win positions Aehr to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers."Additionally, during the quarter, we received a follow-on order from our lead silicon photonics customer for both a new high-power FOX-XP systems and an upgrade of an existing FOX system to our latest high-power, fully automated configuration. As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume."In PLBI, we are seeing significant forecasts from our lead hyperscale customer for our Sonoma systems for high-volume production burn-in of their custom AI processor ASICs used in large-scale data center training and inference AI workloads. In addition to their first ASIC AI processor now ramping on our Sonoma systems today, this quarter this hyperscale customer awarded Aehr the production win for our Sonoma systems for production burn-in of their next-generation, higher-power AI accelerators. We expect a significant near-term follow-on production order from this customer for a large number of systems to be shipped during Aehr's fiscal year 2027."In addition to this major hyperscale customer, we are also engaged in new sales opportunities with multiple other hyperscale companies, AI accelerators and CPU processor companies, edge AI processor suppliers and designers, and foundries and assembly and test houses for our Sonoma PLBI systems for both reliability qualification and production burn-in needs."We are continuing to scale our manufacturing capacity to support anticipated customer demand. In addition to the substantial capacity we added at our Fremont, California facility over the past year, we expect to begin shipping Sonoma systems this quarter from a newly upgraded contract manufacturing facility with global capacity for more than 20 additional systems per month."With strong second-half bookings so far, and a strong funnel of additional orders expected this quarter, we believe we are well-positioned to exit the fiscal year ending May 29th with a strong backlog and deliver significant revenue growth in fiscal 2027. We currently expect full-year fiscal 2026 revenue to be on the high side of the $45 million to $50 million range provided last quarter. We also expect our bookings for the second half of the fiscal year to be on the high end of the $60 million to $80 million range provided last quarter. More broadly, we believe we have a clear path to sustained long-term growth as our installed base expands across AI, silicon photonics, power semiconductors, and other high-performance applications."As the need for performance, reliability, safety, and security in semiconductors continues to rise, burn-in is becoming increasingly important across a widening range of devices and end markets. We believe Aehr is uniquely positioned to capitalize on this trend with both proven WLBI and PLBI solutions that enable our customers to cost-effectively qualify and screen their most advanced semiconductor devices."Financial Guidance:Aehr is reiterating its previously provided guidance for the second half of fiscal year 2026, which began November 29, 2025 and ends May 29, 2026, of revenue between $25 million and $30 million and non-GAAP net loss per diluted share between $(0.09) and $(0.05).Management Conference Call and Webcast:Aehr Test Systems will host a conference call and webcast today at 5:00 p.m. Eastern (2:00 p.m. PT) to discuss its fiscal 2026 third quarter operating results. To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 767066. In addition, a live and archived webcast of the conference call will be available over the Internet at www.aehr.com in the Investor Relations section and may also be accessed by clicking here. A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 53776.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future bookings, benchmark evaluations and product development from Aehr's new and existing customers; future applications and orders for the AI processors, test solutions for AI semiconductor manufacturers and the Sonoma system; revenue and revenue growth forecasted; financial performance and bookings forecasted; financial guidance for the second half of fiscal 2026 and the full fiscal year 2027; expectations regarding current and future partnerships; expectations regarding industry demand and emerging technologies as a whole and smaller segments within it; and the ability for Aehr to successfully enter new markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.- Financial Tables to Follow -AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED STATEMENTS OF OPERATIONS
(Unaudited) Three Months Ended Nine Months Ended February 27, November 28, February 28, February 27, February 28, (In thousands, except per share data) 2026 2025 2025 2026 2025 Revenue $10,313 $9,884 $18,307 $31,166 $44,879 Cost of revenue 6,945 7,339 11,124 21,534 25,218 Gross profit 3,368 2,545 7,183 9,632 19,661 Operating expenses: Research and development 3,167 2,972 3,140 8,988 7,777 Selling, general and administrative 4,430 4,434 5,162 13,581 14,357 Restructuring charges - (213) - 6 - Total operating expenses 7,597 7,193 8,302 22,575 22,134 Loss from operations (4,229) (4,648) (1,119) (12,943) (2,473)Interest income, net 240 194 270 613 1,179 Other income (expense), net (12) 10 (25) 1,049 (11)Loss before income tax benefit (4,001) (4,444) (874) (11,281) (1,305)Income tax benefit (798) (1,214) (231) (2,764) (294)Net loss $(3,203) $(3,230) $(643) $(8,517) $(1,011) Net loss per share: Basic $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Diluted $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Shares used in per share calculations: Basic 30,695 30,177 29,733 30,265 29,500 Diluted 30,695 30,177 29,733 30,265 29,500 AEHR TEST SYSTEMS
RECONCILIATION OF GAAP TO NON-GAAP RESULTS
(Unaudited) Three Months Ended Nine Months Ended February 27, November 28, February 28, February 27, February 28, (In thousands, except per share data) 2026 2025 2025 2026 2025 Reconciliation of GAAP to non-GAAP gross profit GAAP gross profit $3,368 $2,545 $7,183 $9,632 $19,661 Special items: a) Stock-based compensation expense 202 215 218 576 380 b) Acquisition-related adjustments 190 190 416 617 1,045 Non-GAAP gross profit $3,760 $2,950 $7,817 $10,825 $21,086 Reconciliation of GAAP to non-GAAP operating expenses GAAP operating expenses $7,597 $7,193 $8,302 $22,575 $22,134 Special items: a) Stock-based compensation expense (1,182) (1,626) (1,180) (4,320) (2,963)b) Acquisition-related adjustments (106) (106) (106) (317) (247)c) Restructuring charges - 213 - (6) - d) Officer severance benefits - - (653) - (653)e) Acquisition-related costs - - (51) - (548)Non-GAAP operating expenses $6,309 $5,674 $6,312 $17,932 $17,723 Reconciliation of GAAP to non-GAAP income (loss) from operations GAAP loss from operations $(4,229) $(4,648) $(1,119) $(12,943) $(2,473)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 296 522 934 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP income (loss) from operations $(2,549) $(2,724) $1,505 $(7,107) $3,363 Reconciliation of GAAP to non-GAAP income (loss) before income tax benefit GAAP loss before income tax benefit $(4,001) $(4,444) $(874) $(11,281) $(1,305)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 312 522 973 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP income (loss) before income tax benefit $(2,321) $(2,504) $1,750 $(5,406) $4,531 Reconciliation of GAAP to non-GAAP net income (loss) GAAP net loss $(3,203) $(3,230) $(643) $(8,517) $(1,011)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 312 522 973 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP net income (loss) $(1,523) $(1,290) $1,981 $(2,642) $4,825 Reconciliation of GAAP to non-GAAP income (loss) per diluted share GAAP loss per diluted share $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Special items: a) Stock-based compensation expense 0.04 0.06 0.05 0.16 0.11 b) Acquisition-related adjustments 0.01 0.01 0.02 0.03 0.04 c) Restructuring charges - (0.01) - 0.00 - d) Officer severance benefits - - 0.02 - 0.02 e) Acquisition-related costs - - 0.00 - 0.02 Non-GAAP income (loss) per diluted share * $(0.05) $(0.04) $0.07 $(0.09) $0.16 a) Represents compensation expense for equity awards granted to employees and directors.b) Represents amortization of acquired intangible assets and accretion expense of escrow payable.c) Represents a net credit to restructuring charges, primarily related to a lease early termination, along with employee termination benefits from a separate restructuring initiative.d) Represents severance benefits, including compensation expense, provided due to the passing of an officer as per the terms of his change in control and severance agreemente) Represents acquisition activity costs.* Per share amounts may not sum due to rounding to the nearest cent per diluted share Non-GAAP measures should not be considered a replacement for GAAP results. The non-GAAP measures indicated above are financial measures the Company uses to evaluate the underlying results and operating performance of the business. The limitation of these measures are that they exclude items that impact the Company's current period GAAP measures. This limitation is best addressed by using these measures in combination with the most directly comparable GAAP financial measures. These measures are not in accordance with GAAP and may differ from non-GAAP methods of accounting and reporting used by other companies.We believe these measures enhance investors' ability to review the Company's business from the same perspective as the Company's management and facilitate comparisons of this period's results with prior periods.AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED BALANCE SHEETS
(Unaudited) February 27, May 30, (In thousands, except par value) 2026 2025 ASSETS Current assets: Cash and cash equivalents $36,911 $24,529 Accounts receivable 11,808 14,191 Inventories 41,162 41,997 Prepaid expenses and other current assets 6,019 8,061 Total current assets 95,900 88,778 Property and equipment, net 9,277 8,969 Goodwill 10,719 10,719 Intangible assets, net 9,847 10,781 Deferred tax assets, net 21,883 19,114 Operating lease right-of-use assets, net 9,089 9,601 Other non-current assets 331 546 Total assets $157,046 $148,508 LIABILITIES AND SHAREHOLDERS' EQUITY Current liabilities: Accounts payable $2,103 $6,728 Accrued expenses and other current liabilities 4,176 6,020 Operating lease liabilities, short-term 606 909 Deferred revenue, short-term 1,857 1,981 Total current liabilities 8,742 15,638 Operating lease liabilities, long-term 9,419 9,921 Deferred revenue, long-term 53 36 Other long-term liabilities 40 42 Total liabilities 18,254 25,637 Shareholders' equity: Preferred stock, $0.01 par value: Authorized: 10,000 shares; Issued and outstanding: none - - Common stock, $0.01 par value: Authorized: 75,000 shares; Issued and outstanding: 30,954 shares and 29,877 shares at February 27, 2026 and May 30, 2025, respectively 310 299 Additional paid-in capital 170,143 145,758 Accumulated other comprehensive loss (84) (126)Accumulated deficit (31,577) (23,060)Total shareholders' equity 138,792 122,871 Total liabilities and shareholders' equity $157,046 $148,508 AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED SATEMENTS OF CASH FLOWS
(Unaudited) Nine Months Ended February 27, February 28, (In thousands) 2026 2025 Cash flows from operating activities: Net loss $(8,517) $(1,011)Adjustments to reconcile net loss to net cash used in operating activities: Stock-based compensation expense 4,896 3,741 Depreciation and amortization 2,110 1,573 Deferred income taxes (2,769) (293)Amortization of operating lease right-of-use assets 543 795 Changes in operating assets and liabilities: Accounts receivable 2,387 (962)Inventories 203 (2,211)Prepaid expenses and other assets 457 (4,831)Accounts payable (3,476) 139 Accrued expenses (38) (515)Deferred revenue (108) (1,004)Operating lease liabilities (836) (470)Income taxes payable 6 (49)Net cash used in operating activities (5,142) (5,098) Cash flows from investing activities: Purchases of property and equipment (1,932) (2,174)Payments for business acquisition, net of cash and cash equivalents acquired (1,801) (11,075)Net cash used in investing activities (3,733) (13,249) Cash flows from financing activities: Proceeds from issuance of common stock from public offering, net of issuance costs 19,595 - Proceeds from issuance of common stock under employee plans 1,125 894 Shares repurchased for tax withholdings on vesting of restricted stock units (1,273) (520)Net cash provided by financing activities 19,447 374 Effect of exchange rate changes on cash, cash equivalents and restricted cash 9 25 Net increase (decrease) in cash, cash equivalents and restricted cash 10,581 (17,948) Cash, cash equivalents and restricted cash, beginning of period(1) 26,480 49,309 Cash, cash equivalents and restricted cash, end of period (1) $37,061 $31,361 (1) Includes restricted cash within prepaid expenses and other current assets and other non-current assets. Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems Reports Over $37 Million in Quarterly Bookings Driven by Strong AI and Data Center Infrastructure Demand

Aehr Test shares jump 13% after securing silicon photonics system orderMarch 31, 2026 10:50 AM
IH Market News
Shares of Aehr Test Systems (NASDAQ:AEHR) climbed 13% after the company revealed it had received an initial order from a new customer described as a global leader in networking equipment and a key supplier to the data center optical transceiver market.The order covers several systems intended for both engineering qualification and high-volume production. These include a FOX-XP wafer-level burn-in system capable of testing nine wafers simultaneously, a fully integrated WaferPak Auto Aligner, multiple FOX-NP wafer-level burn-in systems, and several sets of FOX WaferPak full-wafer contactors. Delivery of the systems is scheduled for Aehr’s fiscal fourth quarter ending May 29, 2026.According to the company, the customer is developing advanced silicon photonics transceivers designed for data center networking and optical I/O applications, targeting the growing demand for high-speed fiber-optic connectivity in hyperscale AI and cloud infrastructure. Aehr said the customer has already provided forecasts for additional equipment purchases, with potential follow-on orders expected as early as later this year.President and Chief Executive Officer Gayn Erickson said the customer’s decision to order equipment for both qualification and full-scale production at the outset highlights the urgency of expanding manufacturing capacity to support the rapid buildout of hyperscale AI and cloud data centers.Aehr noted it holds a leading position in wafer-level burn-in solutions for silicon photonics transceivers, with installations across major semiconductor and photonics companies worldwide. Its FOX-XP platform supports high-parallelism, high-temperature, and high-power wafer-level burn-in testing, allowing manufacturers to detect early-life device failures before packaging.Erickson added that the company’s high-power FOX-XP configuration can deliver up to 3,500 watts per wafer, a capability already deployed in production at a leading silicon photonics integrated circuit supplier serving data center and optical I/O markets.Aehr Test Systems stock price

Original: Aehr Test shares jump 13% after securing silicon photonics system order

Aehr Wins Major New Silicon Photonics Customer with High-Power FOX-XP Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect MarketMarch 31, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / March 31, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received an initial order from a major new customer that is a global leader in networking products and solutions and a major supplier to the data center optical transceiver market. The customer is developing advanced silicon photonics-based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers.The order includes multiple systems for both engineering qualification and high-volume production, including a FOX-XP™ wafer-level burn-in (WLBI) system configured to test nine wafers in parallel, a fully integrated WaferPak™ Auto Aligner, multiple FOX-NP WLBI systems, and multiple full sets of FOX WaferPak full-wafer Contactors for production, engineering and new product introduction. The systems are scheduled to ship in Aehr's fiscal fourth quarter ending May 29, 2026. The customer has also provided Aehr with a forecast for additional systems, with follow-on orders possible as early as later this calendar year as it ramps capacity to support next generation hyperscale data center deployments."Data center architectures are rapidly evolving as AI infrastructure scales, driving a major transition from traditional copper interconnects to fiber optic communication links to meet the increasing demands for bandwidth, latency, signal integrity, thermal performance, and power efficiency," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "Silicon photonics-based optical transceivers are a critical enabling technology for this transformation, and we believe this order is particularly significant because it comes from a major new customer that is a leading supplier of networking products and solutions for the data center market."What makes this win especially exciting is that the customer is purchasing systems for both engineering qualification and high-volume production up front, reflecting the urgency of the ramp now underway to support the massive buildout of hyperscale AI and cloud data centers. We believe this customer engagement further validates WLBI as an increasingly important part of the silicon photonics manufacturing flow and highlights the potential for silicon photonics to become a meaningful long-term growth driver for Aehr's WLBI business."We believe this win positions Aehr to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers."As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume.Aehr is the market leader in WLBI for silicon photonics transceivers, with a large installed base at leading global semiconductor and photonics companies. The Company's FOX-XP platform enables high-parallelism, high-temperature, and high-power WLBI, allowing customers to identify early-life failures before packaging while significantly reducing cost of test."With our high-power FOX-XP configuration, which we began shipping last year, we offer the highest power-per-wafer WLBI capability in the industry - up to 3,500 watts per wafer," Erickson added. "This proven system is already installed and in production at a world-leading silicon photonics integrated circuit supplier supporting data center and optical I/O applications. In this case, we were able to demonstrate production-ready systems on our manufacturing floor that met the customer's performance and throughput requirements. That capability, combined with our leadership in WLBI for silicon photonics and our ability to support customers from qualification through high-volume production, was a key factor in the customer's decision to select Aehr."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Wins Major New Silicon Photonics Customer with High-Power FOX-XP Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect Market

Aehr Test Systems to Announce Third Quarter Fiscal 2026 Financial Results on April 7, 2026March 30, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / March 30, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced that it will report financial results for its third quarter of fiscal 2026 ended February 27, 2026 on Tuesday, April 7, 2026 following the close of the market. The Company will host a conference call and webcast at 5:00 p.m. Eastern time to discuss the results.What:Aehr Test Systems third quarter fiscal 2026 financial results conference call. When:Tuesday, April 7, at 5:00 p.m. Eastern Time (2:00 p.m. PT). Dial in Number:To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 767066. Webcast:To access the live webcast, please visit the investor relations section at www.aehr.com. Call Replay:A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 53776.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.# # #Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Announce Third Quarter Fiscal 2026 Financial Results on April 7, 2026

Aehr Receives Follow-On Order for Fully Automated Wafer-Level Burn-In Systems Powering AI Optical I/O and Data Center InterconnectsMarch 3, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / March 3, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received a follow-on purchase order from its lead silicon photonics customer for production wafer-level test and burn-in of silicon photonics integrated circuits used in data center optical interconnects and emerging optical I/O architectures for AI processors.The order reflects expanding production volumes as demand accelerates for optical connectivity solutions powering next-generation AI training and inference infrastructure.The order includes:One new ultra-high-power FOX-XP™ wafer-level test and burn-in system with full 300mm SECS/GEM automation, andAn upgrade of an existing FOX-XP system to the new ultra-high power, fully automated configurationEach system is configured to test up to nine 300mm wafers in parallel at up to 3500 watts per wafer and supports up to nine FOX WaferPak™ proprietary full-wafer contactors. The systems also include Aehr's fully integrated FOX WaferPak AutoAligner™ for hands-free, high-volume production.Aehr expects to ship the systems in the second half of calendar 2026.Silicon Photonics and Optical I/O Demand Accelerates With AI Data Center ExpansionSilicon photonics is rapidly becoming a critical enabling technology in next-generation AI data centers, where performance and energy efficiency are increasingly limited by electrical I/O constraints. Industry analysts and hyperscale operators continue to highlight the rapid expansion of optical connectivity within AI clusters, including higher-speed optical transceivers (800G and 1.6T), linear-drive optics (LPO), packaged optics, and co-packaged optics (CPO) architectures. Recent industry reports and hyperscaler announcements point to multi-year growth in fiber-optic infrastructure and silicon photonics deployment tied directly to AI data center buildouts.FOX-XP: High-Power Wafer-Level Burn-In for Silicon Photonics ICsAehr's FOX platform is designed to enable accelerated burn-in, reliability qualification, and production screening at the wafer level, significantly reducing cost and enabling earlier detection of infant mortality and latent reliability issues - particularly important for silicon photonics ICs that will be deployed in high-volume data center environments and high uptime AI infrastructure.Aehr believes it is the first company to successfully demonstrate and ship a multi-wafer burn-in solution for silicon photonics transceivers, enabling earlier reliability screening and significant cost savings compared with traditional package-part testing. It is now seeing increased volumes from its lead customer and other customers, which is driving new production capacity requirements.CEO Commentary"This follow-on order further validates the accelerating adoption of the FOX wafer-level burn-in (WLBI) platform for silicon photonics integrated circuits used in data center optical connectivity and emerging optical I/O architectures for AI processors," said Gayn Erickson, President and CEO of Aehr Test Systems. "Our FOX-XP systems deliver industry-leading power-per-wafer capability, enabling production screening of these high-power, high-current devices at scale."With expanding AI infrastructure deployments and our recent manufacturing capacity enhancements, we believe we are well positioned to support significant growth both in our WLBI and packaged-part burn-in systems as customers ramp production." About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.CONTACT:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Follow-On Order for Fully Automated Wafer-Level Burn-In Systems Powering AI Optical I/O and Data Center Interconnects

Aehr Receives $14 Million Order from Lead AI Processor Customer for Multiple New Fully Automated FOX-XP Wafer Level Burn-In SystemsFebruary 26, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / February 26, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received a $14 million order from its lead AI processor customer for FOX™ systems, WaferPak™ contactors, and Automated WaferPak Auto Aligners for wafer-level burn-in (WLBI) of AI processors used in data center training and inference applications.The order includes multiple new fully automated FOX-XP wafer-level test and burn-in systems, each configured to test nine 300mm wafers in parallel, along with a set of Aehr's proprietary FOX WaferPak full-wafer Contactors and a fully integrated FOX WaferPak Auto Aligner with each system to enable hands-free operation in high-volume production. The products included in this order are scheduled to ship within the next six months."We are pleased to receive this production order from our lead AI processor customer that is a manufacturer and supplier of AI processors used in large-scale data center environments for both training and inference workloads as they continue to expand high-volume manufacturing," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "This order further expands their installed base of FOX-XP systems and adds full automation across their production lines, highlighting the growing importance of WLBI to ensure the long-term reliability of today's very high-power, high-current AI processors."AI processors are increasingly deployed in data centers to support a broad range of applications, including generative AI, large language models, recommendation engines, autonomous systems, and advanced analytics. As power densities, current levels, and device complexity continue to rise, early-life failure screening at the wafer level has become critical to maximizing yield, improving system reliability, and lowering the total cost of ownership for data center operators."Our FOX-XP systems configured for very-high-power, high-current AI processors began shipping last year and provides the highest power-per-wafer capability available in the market, delivering up to thousands of amperes of current per wafer," Erickson added. "We have also recently completed a significant facility upgrade, adding power, cooling infrastructure, and cleanroom space that substantially increases our production capacity. These investments position us well to support what we believe will be significant increases in demand for both our FOX wafer-level and Sonoma package-level test and burn-in systems and consumables."Aehr is the first company to successfully demonstrate and ship a WLBI solution for AI processors. In addition to AI processors, Aehr is now in volume production of WLBI solutions for silicon photonics used in data centers, critical components used in read/write heads for data center-focused hard disk drives, silicon carbide and gallium nitride power semiconductors targeted at data center power infrastructure, and is working closely with a major NAND Flash memory supplier for WLBI of their next generation flash memory wafers targeted at the massive build out of data center and AI training and inference infrastructure. New data and forecasts from Synergy Research Group show that the average capacity of hyperscale data centers to be opened over the next four years will be almost double that of current operational hyperscale data centers and there will also be retrofitting of existing data centers to boost their capacity. The overall result is that the total capacity of all operational hyperscale data centers will grow almost threefold by 2030. This is driving massive growth in semiconductors targeted at these data centers."We are excited to grow alongside this customer as they continue to expand their end-customer relationships and increase market share in the rapidly growing AI processor market," Erickson concluded. About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives $14 Million Order from Lead AI Processor Customer for Multiple New Fully Automated FOX-XP Wafer Level Burn-In Systems

Aehr Test Systems to Participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026February 19, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / February 19, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will host meetings with institutional investors at the Susquehanna 15th Annual Technology Conference taking place at the Lotte New York Palace Hotel in New York on February 26, 2026."We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and packaged-part formats. The growing adoption of wafer-level and packaged-part test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."For additional information or to schedule a meeting with Aehr management, please contact your Susquehanna representative or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.# # #Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026

Aehr Test Systems jumps 15% on AI processor production orderFebruary 11, 2026 10:53 AM
IH Market News
Aehr Test Systems (NASDAQ:AEHR) shares rallied 15% on Wednesday morning after the company announced it had landed a production order for its Sonoma platform from a major hyperscale customer developing next-generation AI chips.The semiconductor test equipment maker said it received an initial order covering multiple Sonoma ultra-high-power package-level test and burn-in systems, along with turnkey burn-in modules and device-specific sockets. The equipment will support production burn-in of the customer’s latest high-power AI processor aimed at data center training and inference workloads.Aehr described the client as a “premier large-scale data center provider” building proprietary AI accelerator ASICs and planning substantial capital investment in AI infrastructure. The newly ordered systems are expected to be delivered in summer 2026.Gayn Erickson, President and CEO of Aehr Test Systems, characterized the deal as “a key early production win for a next-generation AI processor with this world leading hyperscaler.” He added that the customer’s current-generation AI chip is already ramping into high-volume production, with expectations for “a very large expansion of Sonoma system purchases” in the second half of 2026 and continuing into 2027.The Sonoma Ultra platform is engineered to address the high power density, elevated current demands, and advanced thermal management needs of cutting-edge AI processors. The order marks an important endorsement of Aehr’s capabilities in the fast-growing AI semiconductor segment.Aehr Test Systems stock price

Original: Aehr Test Systems jumps 15% on AI processor production order

Aehr Secures Key AI Production Burn-in Win with Initial Order of Sonoma Systems for Lead Hyperscale Customer's Next-Generation AI ASIC ProcessorsFebruary 11, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / February 11, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced a key strategic win with an initial production purchase order from its lead production customer for package-level burn-in of the customer's next-generation, significantly higher-power AI processor used in data center training and inference applications.The initial order includes multiple Aehr Sonoma™ ultra-high-power package-level test and burn-in systems for production burn-in of this next-generation device. Delivery of these systems, along with the fully turnkey burn-in modules (BIMs) and device-specific sockets required for this next generation ASIC AI processor, is scheduled for summer of 2026.This customer is a premier large-scale data center provider that is developing its own proprietary AI accelerator ASICs for large-scale training and inference workloads and has publicly described plans for very significant capital expenditures for AI and data center infrastructure."This is a key early production win for a next-generation AI processor with this world leading hyperscaler," said Gayn Erickson, President and CEO of Aehr Test Systems. "Our Sonoma ultra-high-power systems are uniquely well suited for these new devices, which require very high power and current levels and incorporate multiple thermal zones with independent thermal control per zone on each device during burn-in."Prior disclosures in Aehr's press releases and earnings call transcripts described this customer's plans to introduce substantially higher-power AI processors, and that Aehr was already developing high-temperature operating life (HTOL) qualification burn-in modules for these devices to be deployed at a premier Silicon Valley test house with a large installed base of Aehr Sonoma burn-in systems. This order announcement is important, as until now, Aehr had not officially been awarded the production burn-in business for this new device, so we are very excited about this new win."This customer's current-generation AI processor is already ramping in volume production today, and they are forecasting a very large expansion of Sonoma system purchases for that device in the second half of calendar 2026 and continuing into 2027. Importantly, we expect these future system orders to run in parallel with volume deployments of this next-generation processor, significantly expanding our installed base and long-term consumable opportunity with this customer."Aehr's Sonoma Ultra platform is designed to address the demanding requirements of advanced AI processors, including extreme power density, high-current delivery, and precise, multi-zone thermal management, enabling reliable qualification and burn-in of devices deployed in large-scale AI data center environments."We believe this initial production order positions Aehr very well for high-volume system and consumable shipments later this year and into 2027," added Erickson. "This win further validates our leadership in ultra-high-power package-level burn-in for AI processors and strengthens our long-term growth outlook with hyperscale customers."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Secures Key AI Production Burn-in Win with Initial Order of Sonoma Systems for Lead Hyperscale Customer's Next-Generation AI ASIC Processors

Aehr Test Systems to Participate in the 11th Annual Oppenheimer Emerging Growth Conference on February 3, 2026January 27, 2026 12:30 PM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / January 27, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it will participate in the Oppenheimer 11th Annual Emerging Growth Conference being held virtually February 3-4, 2026. Aehr Test CEO Gayn Erickson and CFO Chris Siuwill be hosting virtual meetings with investors throughout the day on Tuesday, February 3rd."We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong traction with AI processors in both wafer-level and packaged-part formats. The growing adoption of wafer-level and packaged-part test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."For additional information or to schedule a virtual meeting with Aehr Test management, please contact your Oppenheimer representative, or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.# # #Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems to Participate in the 11th Annual Oppenheimer Emerging Growth Conference on February 3, 2026

Hot water $25.90

$AEHR: And now its about to BullFlag...........

The Technical Setup is right there.......... Clear as day.

This one will go.

You heard it here first !!!!!!!!!


GO $AEHR

$AEHR: Massive Sept $35 calls loading today.............

Almost 4800 call contracts taken so far with prem up to $0.90

Something tells me that there are those who know a buyout is coming.

Shareprice now at $24................ look for a $40 min buyout offer

GO $AEHR

AEHR, 10Q due MONDAY 1/13

go go

Onwards and upwards….

AEHR 10 Q due 10 October

AEHR turning the corner the last month also accumulating IceCure ICCM.

$AEHR

I am excited about the future!

AEHR reported
The old fart scores again

AEHR 10Q due JULY16

AEHR new 52 week low

AEHR new 52 week low

AEHR new 52 lo

AEHR 10Q due 4/9

AEHR new 52 week lo

AEHR new 52 week low

AEHR new 52 week low

AEHR new 52 week low

AEHR new 52 week low

AEHR new 52 week low

AEHR new 52 week low truly a dissapointment in the second half of 2023

AEHR Watch for a Short Squeeze above 18.50$ with over 20% Float sold short and nearing 100% institution ownership

AEHR ($24.72)
Jan. 2024 calls
$35 strike
Volume = 505
Open Interest = 4516
Implied volatility = 91.7%
Jan. 2024 calls
$45 strike
Volume = 489
Open Interest = 1925
Implied volatility = 96.09%

Any thoughts about where we go from here? Seems like we found the bottom and are merely trading sideways.