US Market News
2月前
Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer; Second-Half Bookings Exceed $92 MillionApril 16, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / April 16, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a record $41 million follow-on production order from its lead hyperscale customer for package-level burn-in (PLBI) of custom AI processor ASICs. The order is the largest in Aehr's history and supports high-volume production burn-in of ASICs used in data center training and inference AI workloads.The order includes a large quantity of Aehr's Sonoma™ high-power package-level test and burn-in systems, along with fully turnkey burn-in modules (BIMs) and device-specific sockets - the consumables required to configure the Sonoma systems for the customer's specific AI processor. Deliveries under the order are expected to begin in Aehr's fiscal 2027, which starts on June 27, 2026."This $41 million follow-on order from our lead hyperscale package-level burn-in customer brings our bookings in the second half of our fiscal year to more than $92 million to date with six weeks remaining in the fourth quarter and a strong pipeline of forecasted customer orders in place," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "This order further validates our Sonoma platform for high-volume production burn-in of very-high-power AI processor ASICs. Our Sonoma systems first entered production with this customer last year, and this new order reflects their continued ramp in capacity for current-generation devices."This customer is also developing a significantly higher-power AI accelerator ASIC expected to move to production later this year, and they have already placed an initial order with us for multiple Sonoma systems to be used for production for that device. As these next-generation devices move into volume production, we see the potential for further substantial increases in demand for Sonoma systems and consumables in our next fiscal year."Hyperscale cloud providers are increasingly designing custom AI accelerator ASICs to optimize performance, power efficiency, and total cost of ownership for large-scale AI training and inference workloads. Industry analysts project that shipments of hyperscale-designed AI processors will grow at a compound annual growth rate exceeding 30% through 2030, driven by the rapid adoption of generative AI, large language models, and AI-enabled services across cloud computing, enterprise, and consumer applications. As AI processor power levels and integration complexity continue to increase, Aehr believes demand for high-power production burn-in solutions will scale accordingly, expanding the market opportunity for Aehr's Sonoma platform."With this order, Aehr has now booked over $92 million in orders in the second half of this fiscal year, already exceeding our recently increased expectations, which we provided last week, for bookings on the high side of $60 million to $80 million during this period. We also have significant additional customer demand forecasted over the next few months across multiple markets, including AI processor wafer-level and packaged-part production burn-in, silicon photonics wafer-level burn-in, and silicon carbide and gallium nitride power semiconductor wafer-level production burn-in, and we expect a portion of this demand to convert into bookings before the end of this fiscal year. These bookings, together with the growing number and breadth of customer engagements across these market segments, as well as flash and high bandwidth memory, give us improved visibility and increased confidence in significant revenue growth in fiscal 2027 and beyond."To support growing customer demand, Aehr recently completed a significant facility expansion, adding power, cooling infrastructure, and clean-room manufacturing space in our Fremont, California facility. In addition, this quarter we will begin shipping Sonoma systems from a newly upgraded contract manufacturing facility, with capacity for more than 20 additional systems per month. These upgrades meaningfully increase our production capacity and allow us to support very significant growth in shipments of both our Sonoma package-level and FOX™ wafer-level test and burn-in systems, as well as the associated consumables."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer; Second-Half Bookings Exceed $92 Million
US Market News
2月前
Aehr Test Systems Reports Over $37 Million in Quarterly Bookings Driven by Strong AI and Data Center Infrastructure DemandApril 7, 2026 4:05 PM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / April 7, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced financial results for its third quarter of fiscal 2026, ended February 27, 2026.The company reported strong quarterly bookings of $37.2 million, representing a book-to-bill ratio of over 3.5x, reflecting strong customer demand across both wafer-level burn-in (WLBI) and package-level burn-in (PLBI) applications. The company expects a significant near-term follow-on production order from its lead hyperscale customer for PLBI systems for custom AI processors and now expects bookings to be on the high end of the previously stated range of $60 million to $80 million in its fiscal 2026 second half ending May 29, 2026.Fiscal Third Quarter Financial Results:Net revenue was $10.3 million, compared to $18.3 million in the third quarter of fiscal 2025.GAAP net loss was $(3.2) million, or $(0.10) per diluted share, compared to GAAP net loss of $(0.6) million, or $(0.02) per diluted share, in the third quarter of fiscal 2025.Non-GAAP net loss, which excludes stock-based compensation and acquisition-related adjustments, was $(1.5) million, or $(0.05) per diluted share, compared to non-GAAP net income of $2.0 million, or $0.07 per diluted share, in the third quarter of fiscal 2025.Bookings were $37.2 million for the quarter.Backlog as of February 27, 2026 was $38.7 million. Effective backlog, including bookings since February 27, 2026, is $50.9 million.Total cash, cash equivalents and restricted cash as of February 27, 2026 was $37.1 million, compared to $31.0 million on November 28, 2025.Fiscal First Nine Months Financial Results:Net revenue was $31.2 million, compared to $44.9 million in the first nine months of fiscal 2025.GAAP net loss was $(8.5) million, or $(0.28) per diluted share, compared to GAAP net loss of $(1.0) million, or $(0.03) per diluted share, during the first nine months of fiscal 2025.Non-GAAP net loss was $(2.6) million, or $(0.09) per diluted share, which excludes stock-based compensation, acquisition-related adjustments and restructuring charges, compared to non-GAAP net income of $4.8 million, or $0.16 per diluted share, in the first nine months of fiscal 2025.Cash used in operating activities was $5.1 million for the first nine months of fiscal 2026.An explanation of the use of non-GAAP financial measures and a reconciliation of Aehr's non-GAAP financial measures to the most directly comparable GAAP financial measures can be found in the accompanying tables.Gayn Erickson, President and CEO of Aehr Test Systems, commented:"We are very pleased with the strong momentum in our business across multiple market segments, highlighted by more than $37 million in quarterly bookings and a book-to-bill ratio exceeding 3.5x. Demand continues to accelerate across both WLBI and PLBI as semiconductor devices grow in size, complexity, and power and are increasingly deployed in mission-critical AI, networking, automotive, and industrial applications."During the quarter, we continued to make progress in growing the business and expanding our customer base in our WLBI business. For AI processors, we received a production WLBI order from our lead AI processor customer for multiple new fully automated FOX-XP WLBI systems to be used in data center training and inference applications. We have several other companies ranging from suppliers of data center-focused AI accelerator processors to Edge AI processors and CPUs that are providing us with information on their devices and roadmaps and asking about our WLBI capabilities and recommendations for burn-in of their next generation devices. There is significant interest in doing WLBI for devices that are expected to be put in advanced packages such as CoWoS that include other die such as HBM DRAM stacks, other compute AI processors, and photonic or electrical-based transceiver chipsets. Weeding out bad devices before they are packaged together with these other devices is significantly cheaper than the yield loss if these are burned in at packaged level and the entire multi-chip package is thrown away."Silicon photonics is a market we see significant opportunity for WLBI. We recently announced a major new customer win with our high-power FOX-XP WLBI system for devices aimed at hyperscale data center optical interconnect market. This was an initial order for multiple FOX systems for both qualification and production. The customer is developing advanced silicon photonics-based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers. We believe this win positions Aehr to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers."Additionally, during the quarter, we received a follow-on order from our lead silicon photonics customer for both a new high-power FOX-XP systems and an upgrade of an existing FOX system to our latest high-power, fully automated configuration. As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume."In PLBI, we are seeing significant forecasts from our lead hyperscale customer for our Sonoma systems for high-volume production burn-in of their custom AI processor ASICs used in large-scale data center training and inference AI workloads. In addition to their first ASIC AI processor now ramping on our Sonoma systems today, this quarter this hyperscale customer awarded Aehr the production win for our Sonoma systems for production burn-in of their next-generation, higher-power AI accelerators. We expect a significant near-term follow-on production order from this customer for a large number of systems to be shipped during Aehr's fiscal year 2027."In addition to this major hyperscale customer, we are also engaged in new sales opportunities with multiple other hyperscale companies, AI accelerators and CPU processor companies, edge AI processor suppliers and designers, and foundries and assembly and test houses for our Sonoma PLBI systems for both reliability qualification and production burn-in needs."We are continuing to scale our manufacturing capacity to support anticipated customer demand. In addition to the substantial capacity we added at our Fremont, California facility over the past year, we expect to begin shipping Sonoma systems this quarter from a newly upgraded contract manufacturing facility with global capacity for more than 20 additional systems per month."With strong second-half bookings so far, and a strong funnel of additional orders expected this quarter, we believe we are well-positioned to exit the fiscal year ending May 29th with a strong backlog and deliver significant revenue growth in fiscal 2027. We currently expect full-year fiscal 2026 revenue to be on the high side of the $45 million to $50 million range provided last quarter. We also expect our bookings for the second half of the fiscal year to be on the high end of the $60 million to $80 million range provided last quarter. More broadly, we believe we have a clear path to sustained long-term growth as our installed base expands across AI, silicon photonics, power semiconductors, and other high-performance applications."As the need for performance, reliability, safety, and security in semiconductors continues to rise, burn-in is becoming increasingly important across a widening range of devices and end markets. We believe Aehr is uniquely positioned to capitalize on this trend with both proven WLBI and PLBI solutions that enable our customers to cost-effectively qualify and screen their most advanced semiconductor devices."Financial Guidance:Aehr is reiterating its previously provided guidance for the second half of fiscal year 2026, which began November 29, 2025 and ends May 29, 2026, of revenue between $25 million and $30 million and non-GAAP net loss per diluted share between $(0.09) and $(0.05).Management Conference Call and Webcast:Aehr Test Systems will host a conference call and webcast today at 5:00 p.m. Eastern (2:00 p.m. PT) to discuss its fiscal 2026 third quarter operating results. To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 767066. In addition, a live and archived webcast of the conference call will be available over the Internet at www.aehr.com in the Investor Relations section and may also be accessed by clicking here. A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 53776.About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future bookings, benchmark evaluations and product development from Aehr's new and existing customers; future applications and orders for the AI processors, test solutions for AI semiconductor manufacturers and the Sonoma system; revenue and revenue growth forecasted; financial performance and bookings forecasted; financial guidance for the second half of fiscal 2026 and the full fiscal year 2027; expectations regarding current and future partnerships; expectations regarding industry demand and emerging technologies as a whole and smaller segments within it; and the ability for Aehr to successfully enter new markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.- Financial Tables to Follow -AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED STATEMENTS OF OPERATIONS
(Unaudited) Three Months Ended Nine Months Ended February 27, November 28, February 28, February 27, February 28, (In thousands, except per share data) 2026 2025 2025 2026 2025 Revenue $10,313 $9,884 $18,307 $31,166 $44,879 Cost of revenue 6,945 7,339 11,124 21,534 25,218 Gross profit 3,368 2,545 7,183 9,632 19,661 Operating expenses: Research and development 3,167 2,972 3,140 8,988 7,777 Selling, general and administrative 4,430 4,434 5,162 13,581 14,357 Restructuring charges - (213) - 6 - Total operating expenses 7,597 7,193 8,302 22,575 22,134 Loss from operations (4,229) (4,648) (1,119) (12,943) (2,473)Interest income, net 240 194 270 613 1,179 Other income (expense), net (12) 10 (25) 1,049 (11)Loss before income tax benefit (4,001) (4,444) (874) (11,281) (1,305)Income tax benefit (798) (1,214) (231) (2,764) (294)Net loss $(3,203) $(3,230) $(643) $(8,517) $(1,011) Net loss per share: Basic $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Diluted $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Shares used in per share calculations: Basic 30,695 30,177 29,733 30,265 29,500 Diluted 30,695 30,177 29,733 30,265 29,500 AEHR TEST SYSTEMS
RECONCILIATION OF GAAP TO NON-GAAP RESULTS
(Unaudited) Three Months Ended Nine Months Ended February 27, November 28, February 28, February 27, February 28, (In thousands, except per share data) 2026 2025 2025 2026 2025 Reconciliation of GAAP to non-GAAP gross profit GAAP gross profit $3,368 $2,545 $7,183 $9,632 $19,661 Special items: a) Stock-based compensation expense 202 215 218 576 380 b) Acquisition-related adjustments 190 190 416 617 1,045 Non-GAAP gross profit $3,760 $2,950 $7,817 $10,825 $21,086 Reconciliation of GAAP to non-GAAP operating expenses GAAP operating expenses $7,597 $7,193 $8,302 $22,575 $22,134 Special items: a) Stock-based compensation expense (1,182) (1,626) (1,180) (4,320) (2,963)b) Acquisition-related adjustments (106) (106) (106) (317) (247)c) Restructuring charges - 213 - (6) - d) Officer severance benefits - - (653) - (653)e) Acquisition-related costs - - (51) - (548)Non-GAAP operating expenses $6,309 $5,674 $6,312 $17,932 $17,723 Reconciliation of GAAP to non-GAAP income (loss) from operations GAAP loss from operations $(4,229) $(4,648) $(1,119) $(12,943) $(2,473)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 296 522 934 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP income (loss) from operations $(2,549) $(2,724) $1,505 $(7,107) $3,363 Reconciliation of GAAP to non-GAAP income (loss) before income tax benefit GAAP loss before income tax benefit $(4,001) $(4,444) $(874) $(11,281) $(1,305)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 312 522 973 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP income (loss) before income tax benefit $(2,321) $(2,504) $1,750 $(5,406) $4,531 Reconciliation of GAAP to non-GAAP net income (loss) GAAP net loss $(3,203) $(3,230) $(643) $(8,517) $(1,011)Special items: a) Stock-based compensation expense 1,384 1,841 1,398 4,896 3,343 b) Acquisition-related adjustments 296 312 522 973 1,292 c) Restructuring charges - (213) - 6 - d) Officer severance benefits - - 653 - 653 e) Acquisition-related costs - - 51 - 548 Non-GAAP net income (loss) $(1,523) $(1,290) $1,981 $(2,642) $4,825 Reconciliation of GAAP to non-GAAP income (loss) per diluted share GAAP loss per diluted share $(0.10) $(0.11) $(0.02) $(0.28) $(0.03)Special items: a) Stock-based compensation expense 0.04 0.06 0.05 0.16 0.11 b) Acquisition-related adjustments 0.01 0.01 0.02 0.03 0.04 c) Restructuring charges - (0.01) - 0.00 - d) Officer severance benefits - - 0.02 - 0.02 e) Acquisition-related costs - - 0.00 - 0.02 Non-GAAP income (loss) per diluted share * $(0.05) $(0.04) $0.07 $(0.09) $0.16 a) Represents compensation expense for equity awards granted to employees and directors.b) Represents amortization of acquired intangible assets and accretion expense of escrow payable.c) Represents a net credit to restructuring charges, primarily related to a lease early termination, along with employee termination benefits from a separate restructuring initiative.d) Represents severance benefits, including compensation expense, provided due to the passing of an officer as per the terms of his change in control and severance agreemente) Represents acquisition activity costs.* Per share amounts may not sum due to rounding to the nearest cent per diluted share Non-GAAP measures should not be considered a replacement for GAAP results. The non-GAAP measures indicated above are financial measures the Company uses to evaluate the underlying results and operating performance of the business. The limitation of these measures are that they exclude items that impact the Company's current period GAAP measures. This limitation is best addressed by using these measures in combination with the most directly comparable GAAP financial measures. These measures are not in accordance with GAAP and may differ from non-GAAP methods of accounting and reporting used by other companies.We believe these measures enhance investors' ability to review the Company's business from the same perspective as the Company's management and facilitate comparisons of this period's results with prior periods.AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED BALANCE SHEETS
(Unaudited) February 27, May 30, (In thousands, except par value) 2026 2025 ASSETS Current assets: Cash and cash equivalents $36,911 $24,529 Accounts receivable 11,808 14,191 Inventories 41,162 41,997 Prepaid expenses and other current assets 6,019 8,061 Total current assets 95,900 88,778 Property and equipment, net 9,277 8,969 Goodwill 10,719 10,719 Intangible assets, net 9,847 10,781 Deferred tax assets, net 21,883 19,114 Operating lease right-of-use assets, net 9,089 9,601 Other non-current assets 331 546 Total assets $157,046 $148,508 LIABILITIES AND SHAREHOLDERS' EQUITY Current liabilities: Accounts payable $2,103 $6,728 Accrued expenses and other current liabilities 4,176 6,020 Operating lease liabilities, short-term 606 909 Deferred revenue, short-term 1,857 1,981 Total current liabilities 8,742 15,638 Operating lease liabilities, long-term 9,419 9,921 Deferred revenue, long-term 53 36 Other long-term liabilities 40 42 Total liabilities 18,254 25,637 Shareholders' equity: Preferred stock, $0.01 par value: Authorized: 10,000 shares; Issued and outstanding: none - - Common stock, $0.01 par value: Authorized: 75,000 shares; Issued and outstanding: 30,954 shares and 29,877 shares at February 27, 2026 and May 30, 2025, respectively 310 299 Additional paid-in capital 170,143 145,758 Accumulated other comprehensive loss (84) (126)Accumulated deficit (31,577) (23,060)Total shareholders' equity 138,792 122,871 Total liabilities and shareholders' equity $157,046 $148,508 AEHR TEST SYSTEMS
CONDENSED CONSOLIDATED SATEMENTS OF CASH FLOWS
(Unaudited) Nine Months Ended February 27, February 28, (In thousands) 2026 2025 Cash flows from operating activities: Net loss $(8,517) $(1,011)Adjustments to reconcile net loss to net cash used in operating activities: Stock-based compensation expense 4,896 3,741 Depreciation and amortization 2,110 1,573 Deferred income taxes (2,769) (293)Amortization of operating lease right-of-use assets 543 795 Changes in operating assets and liabilities: Accounts receivable 2,387 (962)Inventories 203 (2,211)Prepaid expenses and other assets 457 (4,831)Accounts payable (3,476) 139 Accrued expenses (38) (515)Deferred revenue (108) (1,004)Operating lease liabilities (836) (470)Income taxes payable 6 (49)Net cash used in operating activities (5,142) (5,098) Cash flows from investing activities: Purchases of property and equipment (1,932) (2,174)Payments for business acquisition, net of cash and cash equivalents acquired (1,801) (11,075)Net cash used in investing activities (3,733) (13,249) Cash flows from financing activities: Proceeds from issuance of common stock from public offering, net of issuance costs 19,595 - Proceeds from issuance of common stock under employee plans 1,125 894 Shares repurchased for tax withholdings on vesting of restricted stock units (1,273) (520)Net cash provided by financing activities 19,447 374 Effect of exchange rate changes on cash, cash equivalents and restricted cash 9 25 Net increase (decrease) in cash, cash equivalents and restricted cash 10,581 (17,948) Cash, cash equivalents and restricted cash, beginning of period(1) 26,480 49,309 Cash, cash equivalents and restricted cash, end of period (1) $37,061 $31,361 (1) Includes restricted cash within prepaid expenses and other current assets and other non-current assets. Contacts:Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Test Systems Reports Over $37 Million in Quarterly Bookings Driven by Strong AI and Data Center Infrastructure Demand
US Market News
2月前
Aehr Wins Major New Silicon Photonics Customer with High-Power FOX-XP Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect MarketMarch 31, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / March 31, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received an initial order from a major new customer that is a global leader in networking products and solutions and a major supplier to the data center optical transceiver market. The customer is developing advanced silicon photonics-based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers.The order includes multiple systems for both engineering qualification and high-volume production, including a FOX-XP™ wafer-level burn-in (WLBI) system configured to test nine wafers in parallel, a fully integrated WaferPak™ Auto Aligner, multiple FOX-NP WLBI systems, and multiple full sets of FOX WaferPak full-wafer Contactors for production, engineering and new product introduction. The systems are scheduled to ship in Aehr's fiscal fourth quarter ending May 29, 2026. The customer has also provided Aehr with a forecast for additional systems, with follow-on orders possible as early as later this calendar year as it ramps capacity to support next generation hyperscale data center deployments."Data center architectures are rapidly evolving as AI infrastructure scales, driving a major transition from traditional copper interconnects to fiber optic communication links to meet the increasing demands for bandwidth, latency, signal integrity, thermal performance, and power efficiency," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "Silicon photonics-based optical transceivers are a critical enabling technology for this transformation, and we believe this order is particularly significant because it comes from a major new customer that is a leading supplier of networking products and solutions for the data center market."What makes this win especially exciting is that the customer is purchasing systems for both engineering qualification and high-volume production up front, reflecting the urgency of the ramp now underway to support the massive buildout of hyperscale AI and cloud data centers. We believe this customer engagement further validates WLBI as an increasingly important part of the silicon photonics manufacturing flow and highlights the potential for silicon photonics to become a meaningful long-term growth driver for Aehr's WLBI business."We believe this win positions Aehr to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers."As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume.Aehr is the market leader in WLBI for silicon photonics transceivers, with a large installed base at leading global semiconductor and photonics companies. The Company's FOX-XP platform enables high-parallelism, high-temperature, and high-power WLBI, allowing customers to identify early-life failures before packaging while significantly reducing cost of test."With our high-power FOX-XP configuration, which we began shipping last year, we offer the highest power-per-wafer WLBI capability in the industry - up to 3,500 watts per wafer," Erickson added. "This proven system is already installed and in production at a world-leading silicon photonics integrated circuit supplier supporting data center and optical I/O applications. In this case, we were able to demonstrate production-ready systems on our manufacturing floor that met the customer's performance and throughput requirements. That capability, combined with our leadership in WLBI for silicon photonics and our ability to support customers from qualification through high-volume production, was a key factor in the customer's decision to select Aehr."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Wins Major New Silicon Photonics Customer with High-Power FOX-XP Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect Market
US Market News
3月前
Aehr Receives Follow-On Order for Fully Automated Wafer-Level Burn-In Systems Powering AI Optical I/O and Data Center InterconnectsMarch 3, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / March 3, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received a follow-on purchase order from its lead silicon photonics customer for production wafer-level test and burn-in of silicon photonics integrated circuits used in data center optical interconnects and emerging optical I/O architectures for AI processors.The order reflects expanding production volumes as demand accelerates for optical connectivity solutions powering next-generation AI training and inference infrastructure.The order includes:One new ultra-high-power FOX-XP™ wafer-level test and burn-in system with full 300mm SECS/GEM automation, andAn upgrade of an existing FOX-XP system to the new ultra-high power, fully automated configurationEach system is configured to test up to nine 300mm wafers in parallel at up to 3500 watts per wafer and supports up to nine FOX WaferPak™ proprietary full-wafer contactors. The systems also include Aehr's fully integrated FOX WaferPak AutoAligner™ for hands-free, high-volume production.Aehr expects to ship the systems in the second half of calendar 2026.Silicon Photonics and Optical I/O Demand Accelerates With AI Data Center ExpansionSilicon photonics is rapidly becoming a critical enabling technology in next-generation AI data centers, where performance and energy efficiency are increasingly limited by electrical I/O constraints. Industry analysts and hyperscale operators continue to highlight the rapid expansion of optical connectivity within AI clusters, including higher-speed optical transceivers (800G and 1.6T), linear-drive optics (LPO), packaged optics, and co-packaged optics (CPO) architectures. Recent industry reports and hyperscaler announcements point to multi-year growth in fiber-optic infrastructure and silicon photonics deployment tied directly to AI data center buildouts.FOX-XP: High-Power Wafer-Level Burn-In for Silicon Photonics ICsAehr's FOX platform is designed to enable accelerated burn-in, reliability qualification, and production screening at the wafer level, significantly reducing cost and enabling earlier detection of infant mortality and latent reliability issues - particularly important for silicon photonics ICs that will be deployed in high-volume data center environments and high uptime AI infrastructure.Aehr believes it is the first company to successfully demonstrate and ship a multi-wafer burn-in solution for silicon photonics transceivers, enabling earlier reliability screening and significant cost savings compared with traditional package-part testing. It is now seeing increased volumes from its lead customer and other customers, which is driving new production capacity requirements.CEO Commentary"This follow-on order further validates the accelerating adoption of the FOX wafer-level burn-in (WLBI) platform for silicon photonics integrated circuits used in data center optical connectivity and emerging optical I/O architectures for AI processors," said Gayn Erickson, President and CEO of Aehr Test Systems. "Our FOX-XP systems deliver industry-leading power-per-wafer capability, enabling production screening of these high-power, high-current devices at scale."With expanding AI infrastructure deployments and our recent manufacturing capacity enhancements, we believe we are well positioned to support significant growth both in our WLBI and packaged-part burn-in systems as customers ramp production." About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.CONTACT:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.comPondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives Follow-On Order for Fully Automated Wafer-Level Burn-In Systems Powering AI Optical I/O and Data Center Interconnects
US Market News
3月前
Aehr Receives $14 Million Order from Lead AI Processor Customer for Multiple New Fully Automated FOX-XP Wafer Level Burn-In SystemsFebruary 26, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / February 26, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received a $14 million order from its lead AI processor customer for FOX™ systems, WaferPak™ contactors, and Automated WaferPak Auto Aligners for wafer-level burn-in (WLBI) of AI processors used in data center training and inference applications.The order includes multiple new fully automated FOX-XP wafer-level test and burn-in systems, each configured to test nine 300mm wafers in parallel, along with a set of Aehr's proprietary FOX WaferPak full-wafer Contactors and a fully integrated FOX WaferPak Auto Aligner with each system to enable hands-free operation in high-volume production. The products included in this order are scheduled to ship within the next six months."We are pleased to receive this production order from our lead AI processor customer that is a manufacturer and supplier of AI processors used in large-scale data center environments for both training and inference workloads as they continue to expand high-volume manufacturing," said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. "This order further expands their installed base of FOX-XP systems and adds full automation across their production lines, highlighting the growing importance of WLBI to ensure the long-term reliability of today's very high-power, high-current AI processors."AI processors are increasingly deployed in data centers to support a broad range of applications, including generative AI, large language models, recommendation engines, autonomous systems, and advanced analytics. As power densities, current levels, and device complexity continue to rise, early-life failure screening at the wafer level has become critical to maximizing yield, improving system reliability, and lowering the total cost of ownership for data center operators."Our FOX-XP systems configured for very-high-power, high-current AI processors began shipping last year and provides the highest power-per-wafer capability available in the market, delivering up to thousands of amperes of current per wafer," Erickson added. "We have also recently completed a significant facility upgrade, adding power, cooling infrastructure, and cleanroom space that substantially increases our production capacity. These investments position us well to support what we believe will be significant increases in demand for both our FOX wafer-level and Sonoma package-level test and burn-in systems and consumables."Aehr is the first company to successfully demonstrate and ship a WLBI solution for AI processors. In addition to AI processors, Aehr is now in volume production of WLBI solutions for silicon photonics used in data centers, critical components used in read/write heads for data center-focused hard disk drives, silicon carbide and gallium nitride power semiconductors targeted at data center power infrastructure, and is working closely with a major NAND Flash memory supplier for WLBI of their next generation flash memory wafers targeted at the massive build out of data center and AI training and inference infrastructure. New data and forecasts from Synergy Research Group show that the average capacity of hyperscale data centers to be opened over the next four years will be almost double that of current operational hyperscale data centers and there will also be retrofitting of existing data centers to boost their capacity. The overall result is that the total capacity of all operational hyperscale data centers will grow almost threefold by 2030. This is driving massive growth in semiconductors targeted at these data centers."We are excited to grow alongside this customer as they continue to expand their end-customer relationships and increase market share in the rapidly growing AI processor market," Erickson concluded. About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Receives $14 Million Order from Lead AI Processor Customer for Multiple New Fully Automated FOX-XP Wafer Level Burn-In Systems
US Market News
4月前
Aehr Secures Key AI Production Burn-in Win with Initial Order of Sonoma Systems for Lead Hyperscale Customer's Next-Generation AI ASIC ProcessorsFebruary 11, 2026 7:30 AM
ACCESS NewswireFREMONT, CA / ACCESS Newswire / February 11, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced a key strategic win with an initial production purchase order from its lead production customer for package-level burn-in of the customer's next-generation, significantly higher-power AI processor used in data center training and inference applications.The initial order includes multiple Aehr Sonoma™ ultra-high-power package-level test and burn-in systems for production burn-in of this next-generation device. Delivery of these systems, along with the fully turnkey burn-in modules (BIMs) and device-specific sockets required for this next generation ASIC AI processor, is scheduled for summer of 2026.This customer is a premier large-scale data center provider that is developing its own proprietary AI accelerator ASICs for large-scale training and inference workloads and has publicly described plans for very significant capital expenditures for AI and data center infrastructure."This is a key early production win for a next-generation AI processor with this world leading hyperscaler," said Gayn Erickson, President and CEO of Aehr Test Systems. "Our Sonoma ultra-high-power systems are uniquely well suited for these new devices, which require very high power and current levels and incorporate multiple thermal zones with independent thermal control per zone on each device during burn-in."Prior disclosures in Aehr's press releases and earnings call transcripts described this customer's plans to introduce substantially higher-power AI processors, and that Aehr was already developing high-temperature operating life (HTOL) qualification burn-in modules for these devices to be deployed at a premier Silicon Valley test house with a large installed base of Aehr Sonoma burn-in systems. This order announcement is important, as until now, Aehr had not officially been awarded the production burn-in business for this new device, so we are very excited about this new win."This customer's current-generation AI processor is already ramping in volume production today, and they are forecasting a very large expansion of Sonoma system purchases for that device in the second half of calendar 2026 and continuing into 2027. Importantly, we expect these future system orders to run in parallel with volume deployments of this next-generation processor, significantly expanding our installed base and long-term consumable opportunity with this customer."Aehr's Sonoma Ultra platform is designed to address the demanding requirements of advanced AI processors, including extreme power density, high-current delivery, and precise, multi-zone thermal management, enabling reliable qualification and burn-in of devices deployed in large-scale AI data center environments."We believe this initial production order positions Aehr very well for high-volume system and consumable shipments later this year and into 2027," added Erickson. "This win further validates our leadership in ultra-high-power package-level burn-in for AI processors and strengthens our long-term growth outlook with hyperscale customers."About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.Safe Harbor StatementThis press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.# # #Contacts:Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
vrogers@aehr.com PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.comSOURCE: Aehr Test SystemsView the original press release on ACCESS NewswireOriginal: Aehr Secures Key AI Production Burn-in Win with Initial Order of Sonoma Systems for Lead Hyperscale Customer's Next-Generation AI ASIC Processors
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