Forge Nano Expands Semiconductor Business; Unveils New 200mm Wafer Atomic Layer Deposition Cluster Tool Ahead of SEMICON West
2024年7月1日 - 10:30PM
Forge Nano, Inc., a leading ALD equipment provider and materials
science company, today further expanded into the semiconductor
market with the unveiling of its new Atomic Layer Deposition (ALD)
product offering – TEPHRA™ – Forge Nano’s new single-wafer, ALD
cluster platform. By offering single-wafer ALD coating quality at
throughputs similar to the speed of batch systems, Forge Nano’s
TEPHRA™ will allow customers to produce best-in-class coatings at
commercial scale with unrivaled precursor efficiency and speed.
Powered by Forge Nano’s ALDx technology, which offers ultrathin,
uniform, pinhole-free films with an unprecedented 10x throughput
for single-wafer processing, TEPHRA is dedicated to the
manufacturing of specialty semiconductor applications on 200mm
wafers and below. With 100x efficient chemical use, rapid cycle
times, increased yield, and low-risk manufacturing, TEPHRA is the
only single-wafer cluster tool with commercial throughput speeds
serving applications in advanced packaging, power semiconductor,
radio frequency devices (RFD), microLEDs, microelectromechanical
systems (MEMS), and more.
“TEPHRA is designed to unlock new capabilities to meet the
growing demand of novel More-than-Moore market device applications
that seek high-throughput ALD capabilities without sacrificing film
qualities. Forge Nano will enable advanced device architectures
with groundbreaking efficiency in the semiconductor space with our
innovative ALD wafer tools that prioritize cost, performance and
efficiency,” said Paul Lichty, CEO of Forge Nano. “With TEPHRA,
Forge Nano is opening new coating solutions and opportunities for
our proprietary coating techniques that address high aspect ratio
structures, which have previously been underserved in the
semiconductor industry.”
Forge Nano’s ALDx technology enables conformal coatings to scale
to aspect ratios greater than 10:1. With a flagship all-ALD Metal
Barrier Seed film application, TEPHRA offers nitride and metal
depositions in high aspect ratio structures for advanced 3D
integration applications, including through silicon and through
glass vias. By moving beyond 10:1 aspect ratios, manufacturers can
scale their packaging processes and reduce power consumption by
overcoming common pitfalls of directional deposition technologies,
including PEALD, which struggle with conformality and void
formation.
TEPHRA is available in a range of configurations with the option
for four-sided, six-sided and eight-sided cluster platforms. TEPHRA
can process wafers up to 200 mm between 80 and 300°C with six
process precursor channels and dedicated chambers for oxide,
nitride and metal depositions. TEPHRA™ also features Forge Nano’s
patented CRISP technology, a suite of catalyzed thermal ALD
processes that enable low temperature and hard-to-deposit materials
without the need for plasma.
For more information on Forge Nano’s TEPHRA™ product, visit the
TEPHRA product page at: https://www.forgenano.com/products/tephra.
SEMICON West 2024 attendees can stop by the Forge Nano booth
(#133), located in the south exhibition hall, for additional
product information and to discuss capabilities with our product
specialists.
About Forge Nano
Forge Nano is changing the way products perform. With our
proprietary Atomic Armor™ coating technology, Forge Nano enables
battery material providers, semiconductor fabricators and a host of
high-tech product engineers to design their technology down to the
individual atom. The superior Atomic Layer Deposition surface
coatings produced by our Atomic Armor process allow our partners to
unlock peak performance by optimizing products to last longer, cost
less and increase performance and safety. Our team of scientists
have worked with an expansive portfolio of commercial partners to
develop custom solutions to meet any need at any scale, from
small-scale R&D and laboratory work to large-scale, high-volume
production. Learn more at https://www.forgenano.com.
Contact
Will McKennaBrand Communications Director for Forge
Nanowmckenna@forgenano.com(720) 432-6669
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/486cdce9-680d-4786-819b-e30f7c2d873f