FREMONT, Calif., June 26, 2024 /PRNewswire/ -- YES (Yield
Engineering Systems, Inc.), a leading manufacturer of process
equipment for semiconductor advanced packaging applications, today
announced that it has delivered multiple VeroTherm Formic Acid
Reflow (FAR) systems to leading logic and memory customers. This
system will be utilized to enable 3D stacking of memory and logic
chips required to support the growth of high-performance AI
accelerators driven by large language model (LLM) applications.
The VeroTherm FAR system is designed to provide solutions for
achieving sub 10-micron micro-bump structures with fluxless solder
and mass reflow processes. This system enables superior quality and
total cost of ownership (CoO) particularly for the manufacturing of
advanced packaging architectures such stacked logic and high
bandwidth memory (HBM) that are an integral part of the AI
accelerators currently being launched in the market.
"The VeroTherm offers unique single wafer chamber design with
flexibility to improve reflow quality and addresses challenges
associated with reduced bump pitches. YES has demonstrated superior
reflow results with no bump cracking defects observed at sub-30
micron pitch and no collapsed bumps with pitches down to 12um. YES
proprietary process also results in defect-free solder reflow
resulting in high throughput and low CoO. These results can extend
bump-based mass reflow technology to sub-10um pitch," said Alex
Chow, SVP Global Sales at YES. "These orders are an important
milestone for YES as it is a validation of our efforts to serve the
multiple market segments," Chow added.
According to Saket Chadda, SVP
and GM, Dry Business Unit at YES, "Our Verotherm FAR wafer product
line offers vacuum based single wafer processing with unique
capabilities of performing the task of removing oxides and
reflowing solder into excellent bump shapes without defects found
in older atmospheric pressure systems. It eliminates SnAg
agglomerate defects and rough surfaces while minimizing
inter-metallic compound zones with extendibility down to sub-10um
micron pitches."
About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer
of high-tech, cost-effective equipment for transforming surfaces,
materials and interfaces. The company's product lines include
vacuum cure ovens, chemical vapor deposition (CVD) systems, and
plasma etching tools used for precise surface modification and
thin-film coating of semiconductor wafers, semiconductor and MEMS
devices, and biodevices. With YES, customers ranging from startups
to Fortune 100 companies can create and volume-produce products in
a wide range of markets, including Advanced Packaging, MEMS,
Augmented Reality/Virtual Reality and Life Sciences. YES is
headquartered in Fremont,
California, with a growing global presence. For more
information, please visit www.yieldengineering.com.
Media Contact
Alex Chow
SVP Business Development & Mktg / Asia
President
YES (Yield Engineering Systems, Inc.)
+886-926136155 direct
achow@yieldengineering.com
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