Egide (0OJ4)

Egide S.A., together with its subsidiaries, develops, manufactures, and sells hermetic package solutions for micro-electronic and optical product applications in France, EEC outside France, the United States, Canada, and internationally. The company offers designs and manufactures packages for the t... Egide S.A., together with its subsidiaries, develops, manufactures, and sells hermetic package solutions for micro-electronic and optical product applications in France, EEC outside France, the United States, Canada, and internationally. The company offers designs and manufactures packages for the thermal imaging market; window assemblies, high-precision window holders, high temperature co-fired ceramic (HTCC) feedthroughs, hermetic housing, ceramic boards, getter welding, and cold fingers for cooled IR systems; and power packages. It also provides protection and interconnection of the opto-electroncis chips; various RF packages for various markets; RF and DC glass beads, and SMPM connector; and HTCC packages, including surface mount and lead-frame, as well as leadless packages comprising ball grid array, land grid array, quad flat no-lead and leadless chip carrier, and pin grid array, HTTC connectors, and HTCC ceramic substrates. The company serves defense/space, telecommunications, industrial/energy, medical, opto-electronics, infra-red, sensors, RF, communications, and other markets. Egide S.A. was incorporated in 1986 and is headquartered in Bollène, France. 詳細を表示