Today at the SPIE Advanced Lithography + Patterning conference,
Applied Materials, Inc. introduced a portfolio of products and
solutions designed to address the patterning requirements of chips
in the “angstrom era.” As chipmakers transition to process nodes at
2nm and below, they increasingly benefit from new materials
engineering and metrology techniques that help overcome EUV and
High-NA EUV patterning challenges, including line edge roughness,
tip-to-tip spacing limitations, bridge defects and edge placement
errors.
Sculpta Momentum: Growing Adoption and New
Applications
At last year’s SPIE lithography conference, Applied introduced
the Centura® Sculpta® patterning system, which allows chipmakers to
reduce EUV double patterning steps by elongating patterned
features, bringing the tips of the features closer together than
achievable with a single EUV or High-NA EUV exposure. Applied is
now working with all leading-edge logic chipmakers on a growing
number of Sculpta applications. For example, in addition to
reducing tip-to-tip spacing, chipmakers are using Sculpta to remove
bridge defects, thereby enabling reduced patterning cost and
improved chip yield.
“Leading chipmakers are seeing excellent results as they deploy
Sculpta systems in production and explore additional applications
beyond EUV double patterning step reduction,” said Dr. Prabu Raja,
President of the Semiconductor Products Group at Applied Materials.
“Sculpta is an entirely new tool in the patterning engineer’s tool
kit that will be used in many more applications as engineers use
their imaginations to solve challenging problems in new ways.”
“Pattern shaping is an innovative solution that is helping Intel
accelerate its process technology roadmap,” said Ryan Russell,
Corporate Vice President for Logic Technology Development at Intel.
“We are deploying Sculpta systems for our angstrom process nodes,
with initial results showing improved throughput, enhanced wafer
yield, and reduced process complexity and cost. Pattern shaping
facilitates new strategies for advanced patterning and paves the
way for pushing lithographic print boundaries.”
“Pattern shaping is a breakthrough technology that addresses key
challenges in the EUV era,” said Jong-Chul Park, Master of Foundry
Etch Technology Team at Samsung Electronics. “Samsung is an early
development partner and is evaluating the Sculpta systems for our
4nm process. We are looking forward to positive results, including
reduced cost and complexity and increased yield.”
New Etch Technology Heals EUV Line Edge
Roughness
EUV systems produce fewer of the photons needed to crisply
define line and space patterns in photoresists. As a result, lines
with rough edges are etched into the wafer, potentially creating
open and short circuits in the chip. These yield-killing defects
are becoming more prevalent as chipmakers implement angstrom era
designs with narrower line and space patterns.
Applied today introduced the Sym3® Y Magnum™ etch system, which
combines deposition and etch technology in the same chamber. The
unique system deposits material along rough edges, making EUV line
patterns smoother before they are etched into the wafer, enabling
an increase in yields and a decrease in line resistance to improve
chip performance and power consumption. In foundry-logic, Sym3 Y
Magnum has already been adopted for critical etch applications at
leading chipmakers and is now being deployed for EUV patterning in
angstrom era nodes. In memory, Sym3 Y Magnum is the most widely
adopted etch technology for EUV patterning in DRAM.
New CVD Patterning Film for Angstrom Era
Patterning
Applied today introduced the Producer® XP Pioneer® CVD (chemical
vapor deposition) patterning film. The Pioneer film is deposited
on the wafer prior to photoresist pattern processing and is
uniquely designed to transfer desired patterns to the wafer with
exceptional fidelity. Pioneer is based on a unique high-density
carbon formula that is more resilient to etch chemistries used in
the most advanced process nodes, permitting thinner film stacks
with superior sidewall feature uniformity. Pioneer has already been
adopted by leading memory manufacturers for DRAM patterning.
Pioneer has been co-optimized with Applied’s Sculpta
pattern-shaping technology, enabling patterning engineers to
maximize pattern elongation while maintaining tight control of the
original EUV pattern. Pioneer is also being co-optimized with the
new Sym3 Y Magnum etch system to provide higher selectivity and
better control over conventional carbon films for critical etch
applications in logic and memory processing.
Avoiding Placement Errors: Introducing
Aselta
Applied’s industry-leading eBeam metrology systems are used by
the world’s leading logic and memory companies to develop and
control their most critical EUV patterning applications. A major
challenge is tightly defining and placing the billions of features
on each layer so they properly align with their opposite features
on the next layer of the chip. Small placement errors reduce chip
performance and power consumption, and large errors create
yield-killing defects.
Applied has acquired Aselta Nanographics, a technology leader in
design-based metrology using contours. Contours enable patterning
engineers to gather orders of magnitudes more data about the shapes
their recipes are creating in patterning films and on the wafer.
This data is fed back into the lithography and process flow to
create more exact on-chip features and placement.
“Aselta contour technology is now being integrated with
Applied’s VeritySEM® CD-SEM system and PROVision® eBeam metrology
system to give chipmakers a unique end-to-end capability that
addresses the full spectrum of angstrom era metrology challenges,”
said Keith Wells, Group Vice President of Imaging and Process
Control at Applied Materials.
A Growing Patterning Portfolio and Business
Since 2012, Applied Materials has made patterning a research and
development priority, investing to deliver new products and
solutions that help customers overcome their toughest patterning
challenges, particularly in emerging EUV and High-NA EUV
applications. The company’s patterning product portfolio today
includes CVD and ALD deposition; four types of materials removal
(etch, selective materials removal, pattern shaping and CMP);
thermal processes; and eBeam metrology. The company has increased
its served available market in patterning from around $1.5 billion
in 2013 to more than $8 billion in 2023 – and grown its share of
the opportunity from about 10 percent to more than 30 percent over
the same timeframe.
Forward-Looking StatementsThis press release
contains forward-looking statements, including those regarding
anticipated benefits of our new products and technologies; expected
growth and trends in our businesses and markets, industry outlooks
and demand drivers, technology transitions, and other statements
that are not historical facts. These statements and their
underlying assumptions are subject to risks and uncertainties and
are not guarantees of future performance. Factors that could cause
actual results to differ materially from those expressed or implied
by such statements include, without limitation: failure to realize
anticipated benefits of our new products and technologies; the
demand for semiconductors; customers’ technology and capacity
requirements; the introduction of new and innovative technologies,
and the timing of technology transitions; market acceptance of
existing and newly developed products; the ability to obtain and
protect intellectual property rights in technologies; our ability
to ensure compliance with applicable law, rules and regulations;
and other risks and uncertainties described in our SEC filings,
including our recent Forms 10-Q and 8-K. All forward-looking
statements are based on management’s current estimates, projections
and assumptions, and we assume no obligation to update them.
About Applied MaterialsApplied Materials, Inc.
(Nasdaq: AMAT) is the leader in materials engineering solutions
used to produce virtually every new chip and advanced display in
the world. Our expertise in modifying materials at atomic levels
and on an industrial scale enables customers to transform
possibilities into reality. At Applied Materials, our innovations
make possible a better future. Learn more at
www.appliedmaterials.com.
Contact:Ricky Gradwohl (editorial/media)
408.235.4676Michael Sullivan (financial community) 408.986.7977
Photos accompanying this announcement are available
at:
https://www.globenewswire.com/NewsRoom/AttachmentNg/7f18da3e-ea63-4c18-b31c-49abb997cf99
https://www.globenewswire.com/NewsRoom/AttachmentNg/c1db1fa0-62fd-41bb-8bb2-6b1cc415ba29
Applied Materials (NASDAQ:AMAT)
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Applied Materials (NASDAQ:AMAT)
過去 株価チャート
から 6 2023 まで 6 2024