UMC Files Patent Infringement Lawsuit against Micron
2018年1月12日 - 5:47PM
ビジネスワイヤ(英語)
Litigation covers three memory products sold in
China that violate UMC’s patent rights
United Microelectronics Corporation (NYSE:UMC; TWSE:2303)
("UMC"), a leading global semiconductor foundry, today announced
that the company has filed a patent infringement lawsuit against
Micron Semiconductor (Xi'an) Co., Ltd. and Micron Semiconductor
(Shanghai) Co., Ltd. in the Fuzhou Intermediate People's Court of
the People’s Republic of China (PRC). The lawsuit covers three
areas that allegedly infringe upon UMC’s patent rights in China,
including specific memory applications that relate to DDR4, SSD and
memory used in graphics cards.
In the complaint, UMC has requested the court to order the
defendant(s) to stop manufacturing, processing, importing, selling
and intending to sell the allegedly infringing products, destroy
all inventory and related molds and tools and demand that Micron
compensate the company for a total amount of RMB 270 million in
damages.
UMC has devoted a great deal of resources and manpower to
researching and developing semiconductor manufacturing technology.
Its achievements can be applied to logic chips or memory chips
(DRAM), and the company has applied for patents in various
countries while continuing to monitor these patents as market
conditions evolve. After conducting an in-depth review, UMC found
that Micron's products sold in mainland China did indeed infringe
upon the patent rights of the company, and thus patent infringement
litigation has been pursued in order to obtain fair judgment.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry that provides advanced IC production for applications
spanning every major sector of the electronics industry. UMC’s
robust foundry solutions enable chip designers to leverage the
company’s sophisticated technology and manufacturing, which include
high volume production 28nm gate-last High-K/Metal Gate technology,
ultra-low power platform processes specifically engineered for
Internet of Things (IoT) applications and the automotive industry’s
highest-rated AEC-Q100 Grade-0 manufacturing capabilities for
production of ICs found in cars. UMC’s 11 wafer fabs are
strategically located throughout Asia and are able to produce over
500,000 wafers per month. The company employs nearly 19,000 people
worldwide, with offices in Taiwan, China, Europe, Japan, Korea,
Singapore, and the United States. UMC can be found on the web at
http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward
looking within the meaning of the U.S. Federal Securities laws,
including statements about future outsourcing, wafer capacity,
technologies, business relationships and market conditions.
Investors are cautioned that actual events and results could differ
materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market
and economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission, including its registration
statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in
each case as amended. UMC does not undertake any obligation to
update any forward-looking statement as a result of new
information, future events or otherwise, except as required under
applicable law.
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version on businesswire.com: http://www.businesswire.com/news/home/20180112005155/en/
UMCRichard Yu, 886-2-2658-9168 ext. 16951richard_yu@umc.com