UMC Obtains LEED Gold Certification for Fab 12X
2017年10月30日 - 6:00PM
ビジネスワイヤ(英語)
Xiamen based Fab 12X scores highest among all
12" foundry fabs in China, highlighting UMC’s continued efforts to
enhance green sustainability
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)
("UMC"), a leading global semiconductor foundry, today announced
that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership
in Energy and Environmental Design) Gold recognition from the U.S.
Green Building Council. The state-of-the-art fab achieved the
highest combined score among all 300mm foundry fabs in China,
including a perfect score for Water Efficiency. This milestone
further demonstrates UMC’s commitment to green building and
environmentally sustainable operations.
M.L. Liao, vice president in charge of manufacturing resources
integration and the environmental committee at UMC said, “UMC has
initiated and implemented green measures not only to enhance
energy-conservation for existing fabs, but also to ensure that new
fabs meet and exceed the latest green building standards. Fab 12X’s
LEED Gold certification is a significant milestone in our efforts
to promote sustainable manufacturing. Going forward, UMC will
continue to fulfill its responsibility as a corporate citizen and
base its development on green building concepts to promote the
formation of a low-carbon, sustainable society.”
UMC’s Fab 12X is southern China's first 300mm foundry facility.
The fab is in mass production for 40nm and 28nm technologies, with
a maximum design capacity of 50,000 wafers per month. The Xiamen
based fab is a short distance from Taiwan, allowing seamless
support from UMC’s Taiwan headquarters. Fab 12X offers diversified
300mm manufacturing in addition to UMC’s two other 300mm fabs in
Taiwan and Singapore, and complements Hejian fab in Suzhou, China,
which provides 8" foundry services.
About UMCUMC (NYSE: UMC, TWSE: 2303) is a leading global
semiconductor foundry that provides advanced IC production for
applications spanning every major sector of the electronics
industry. UMC’s robust foundry solutions enable chip designers to
leverage the company’s sophisticated technology and manufacturing,
which include high volume production 28nm gate-last High-K/Metal
Gate technology, ultra-low power platform processes specifically
engineered for Internet of Things (IoT) applications and the
automotive industry’s highest-rated AEC-Q100 Grade-0 manufacturing
capabilities for production of ICs found in cars. UMC’s 11 wafer
fabs are strategically located throughout Asia and are able to
produce over 500,000 wafers per month. The company employs nearly
19,000 people worldwide, with offices in Taiwan, China, Europe,
Japan, Korea, Singapore, and the United States. UMC can be found on
the web at http://www.umc.com.
Note from UMC Concerning Forward-Looking StatementsSome
of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including
statements about future outsourcing, wafer capacity, technologies,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission, including its registration
statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in
each case as amended. UMC does not undertake any obligation to
update any forward-looking statement as a result of new
information, future events or otherwise, except as required under
applicable law.
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version on businesswire.com: http://www.businesswire.com/news/home/20171030005360/en/
UMCRichard Yu, (886) 2-2658-9168 ext.
16951richard_yu@umc.com