Nidec Completes Acquisition of SV Probe Pte. Ltd., a Probe Card Manufacturer
2017年10月31日 - 06:15PM
Nidec Corporation (TSE:6594) (OTC US:NJDCY) (the “Company” or
“Nidec”) today announced that the Company has completed the
acquisition of 100% equity shares of SV Probe Pte. Ltd. (“SV
Probe”), a probe card manufacturer, from its Singapore-based parent
company Ellipsiz Ltd. (the “Transaction”) through the Company’s
subsidiary, Nidec-Read Corporation. The Transaction was performed
in line with the acquisition plan announced on August 21, 2017. As
a result of the Transaction, SV Probe became a consolidated
subsidiary of Nidec, as outlined below:
1. Outline of New
Subsidiary
(1 |
) |
Company
Name: |
SV Probe
Pte. Ltd.(to be renamed “Nidec SV Probe Pte. Ltd.” effective
October 1, 2018) |
(2 |
) |
Headquarters: |
Serangoon,
Singapore |
(3 |
) |
Representative: |
Kevin
Michael Kurtz, President & CEO |
(4 |
) |
Principal Business: |
Manufacturing and sale of probe cards |
(5 |
) |
Capital: |
SGD 29.3
million |
(6 |
) |
Foundation: |
1994 (became
a wholly owned subsidiary of Ellipsiz in 2006) |
(7 |
) |
Ownership: |
Nidec-Read
Corporation: 100% |
(8 |
) |
Employees: |
978 (as of
February 2017, consolidated basis) |
(9 |
) |
Locations: |
Singapore,
Taiwan, China, Japan, Vietnam, USA |
(10 |
) |
Financials: |
Revenue: SGD
74.9 millionEBIT: SGD 11.7 million (EBIT ratio: 15.6%)(fiscal year
ended June 30, 2017, consolidated basis) |
2. Purpose of the Transaction and Future Operation
Policy
Nidec-Read’s main business is the development,
manufacturing and sale of inspection equipment for semiconductor
package substrates and printed circuit boards, as well as
inspection fixture. In recent years, it has expanded its product
portfolio into small capacitance measurement equipment for touch
screen panels and optical inspection equipment for semiconductor
wafers. Embedded electronic active/passive components in
smartphones and IoT devices are required to be increasingly small
and power efficient. Also, new semiconductor packaging technologies
that created embedded electronic component substrates and Fan
Out Wafers Level Packages (FOWLP)1 are diversifying and
tightening inspection requirements. Nidec-Read has sought for a new
inspection method that responds to the foregoing development in
semiconductor packaging and that ensures its mid- to long- term
growth target. The acquisition of SV Probe is Nidec-Read’s
important step in that direction.
SV Probe was established in the United States in
1994 as a manufacturer of probe cards for semiconductor wafer
inspection, with footholds in Japan, Singapore, Taiwan, China and
Vietnam.
Through the Transaction, Nidec-Read expects to gain
competitiveness in the inspection market by applying its MEMS
spring probe2 technology to the vertical probe
cards3 manufactured by SV Probe. In addition, by mutually
sharing its cutting-edge processing and assembly technology with SV
Probe, Nidec-Read will be able to reduce manufacturing costs and
improve investment efficiency. Nidec-Read also expects to sell its
inspection equipment through SV Probe’s sales channel to the
leading semiconductor manufactures.
1 A package formed by expanding redistribution layer, which
is connecting a semiconductor chip and a printed board, to the
outside of a semiconductor chip by using a semiconductor process.2
Contact needle for energization testing with small diameter spring
shape manufactured by Nidec-Read’s unique micro 3D pattern creation
technology (photolithography).3 A fixture for inspecting the
electrical characteristics of a semiconductor chip which has
contact needles arranged vertically standing to the semiconductor
chip.
3. Effect on Financial Performance for the Current
Fiscal Year
The Transaction is expected to have no significant
impact on the Company’s consolidated financial performance for the
fiscal year ending March 31, 2018. The Company will make additional
disclosure on a timely basis in accordance with the rules of the
Tokyo Stock Exchange upon determination of further details.
Cautionary Statement Concerning
Forward-Looking Information
This press release contains forward-looking
statements regarding the intent, belief, strategy, plans or
expectations of the Nidec Group or other parties. Such
forward-looking statements are not guarantees of future performance
or events and involve risks and uncertainties. Actual results may
differ materially from those described in such forward-looking
statements as a result of various factors, including, but not
limited to, the risks to successfully integrating the acquired
business with the Nidec Group, the anticipated benefits of the
planned transaction not being realized, changes in general economic
conditions, shifts in technology or user preferences for particular
technologies, other risks relating to changes in business and
regulatory environments. The Nidec Group does not undertake any
obligation to update the forward-looking statements contained
herein or the reasons why actual results could differ from those
projected in the forward-looking statements except as may be
required by law.
Contact:Masahiro NagayasuGeneral ManagerInvestor
Relations+81-75-935-6140ir@nidec.com