ASE Receives ISO 26262 Certification Standard Related to the Safety of Electrical and Electronic Systems Within a Car
2016年10月14日 - 4:00PM
ビジネスワイヤ(英語)
Key enabler for ASE to support the highly
demanding safety and functional standards required in automotive
device manufacturing
Advanced Semiconductor Engineering, Inc (ASE, TAIEX:2311,
NYSE:ASX), the leading provider of semiconductor assembly and test
services, today announced that its Chung Li, Taiwan facility has
received the ISO 26262 certification from TÜV NORD, a technical
service provider that helps companies to validate the safety of
products and services. ISO 26262 is a standard related to the
safety of electrical and electronic systems within a car and
addresses possible hazards caused by malfunctioning behavior of
safety-related systems, including interaction of these
systems.1
‘The increasing number of electronic functions in an automotive
vehicle has added to the complexity in automotive manufacturing.
Such complexity also adds to the increased need for the IC assembly
manufacturing process to adhere to strict automotive benchmarks and
practices in order to achieve zero ppm in automotive testing. Zero
ppm creates a mindset that strives to guarantee quality and
reliability to ensure that vehicles are safe and dependable,’ says
TS Chen, President of ASE Chung Li. ‘ASE has invested time,
financial and human resources to train its engineers to identify
and manage risks within the manufacturing process and to avoid
these risks by providing appropriate requirements and processes as
outlined in the ISO 26262 standards,’ he continued.
The ASE Chung Li site has been in the forefront of automotive IC
assembly and testing, providing many of the industry’s top tier
automotive device players with packaging solutions for almost two
decades. The facility is also TS 16949 certified and continues to
improve its quality and safety standards by undertaking global
certification programs. The ISO 26262 certification will greatly
benefit customers and ASE as both parties would be able to shorten
the time needed to verify the functional safety of all products and
enable customers to reach their intended markets quickly.
Heterogeneous integrated package solutions such as ASE’s
System-in-Package, MEMS and sensor module solutions are robust
technologies developed for the myriad and sophisticated electronics
that make automotive vehicles smarter and safer. In an industry
that innovates non-stop, ASE is poised to grow its IC packaging
portfolio and technology capability as well as the adoption of
international safety and quality standards for the future in
connected and autonomous cars.
About The ASE Group
The ASE Group is among the leading providers of independent
semiconductor manufacturing services in assembly, test, materials
and design manufacturing. As a global leader geared towards meeting
the industry’s ever growing needs for faster, smaller and higher
performance chips, the Group develops and offers a wide portfolio
of technology and solutions including IC test program design,
front-end engineering test, wafer probe, wafer bump, substrate
design and supply, wafer level package, flip chip,
system-in-package, final test and electronic manufacturing services
through Universal Scientific Industrial Co., Ltd. and its
subsidiaries, members of the ASE Group. For more information about
the ASE Group, visit www.aseglobal.com.
Safe Harbor Notice
This press release contains "forward-looking statements" within
the meaning of Section 27A of the United States Securities Act of
1933, as amended, and Section 21E of the United States Securities
Exchange Act of 1934, as amended, including statements regarding
our future results of operations and business prospects. Although
these forward-looking statements, which may include statements
regarding our future results of operations, financial condition or
business prospects, are based on our own information and
information from other sources we believe to be reliable, you
should not place undue reliance on these forward-looking
statements, which apply only as of the date of this press release.
The words “anticipate, “believe,” “estimate,” “expect,” “intend,”
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to identify these forward-looking statements in this press release.
Our actual results of operations, financial condition or business
prospects may differ materially from those expressed or implied in
these forward-looking statements for a variety of reasons,
including risks associated with cyclicality and market conditions
in the semiconductor or electronic industry; changes in our
regulatory environment, including our ability to comply with new or
stricter environmental regulations and to resolve environmental
liabilities; demand for the outsourced semiconductor packaging,
testing and electronic manufacturing services we offer and for such
outsourced services generally; the highly competitive semiconductor
or manufacturing industry we are involved in; our ability to
introduce new technologies in order to remain competitive;
international business activities; our business strategy; our
future expansion plans and capital expenditures; the uncertainties
as to whether we can complete the acquisition of 100% of
Siliconware Precision Industries Co., Ltd. shares not otherwise
owned by ASE; the strained relationship between the Republic of
China and the People’s Republic of China; general economic and
political conditions; the recent global economic crisis; possible
disruptions in commercial activities caused by natural or
human-induced disasters; fluctuations in foreign currency exchange
rates; and other factors. For a discussion of these risks and other
factors, please see the documents we file from time to time with
the Securities and Exchange Commission, including our 2015 Annual
Report on Form 20-F filed on April 29, 2016.
1 Source: Semiengineering online, Knowledge Center, ISO
26262.
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version on businesswire.com: http://www.businesswire.com/news/home/20161014005167/en/
The ASE GroupAsiaJennifer
YuenJennifer.Yuen@aseus.comUS/EuropePatricia
MacLeodPatricia.MacLeod@aseus.com